Applied sciences

Bulletin of the Polish Academy of Sciences: Technical Sciences

Content

Bulletin of the Polish Academy of Sciences: Technical Sciences | 2004 | vol. 52 | No 4 |

Abstract

A short overview of the developments of functional materials featuring miniaturisation and integration is illustrated by examples taken from the ?eld of ceramic functional materials. To obtain new materials new methods are required. Most of them are microfabrication processes developed by the "top-down" approach.

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Abstract

Biocompatible coatings produced on the basis of the chemically extracted natural hydroxyapatite (HAp) from the animal bones were deposited using multiplex method comprising glow discharge nitriding (GDN) of the titanium alloy substrate and pulsed laser deposition (PLD) of HAp on the formerly fabricated titanium nitride layer (TiN). The TiN interlayer plays an important role improving adhesion of HAp to substrate and preserves the direct contact of the tissue with metallic substrate in the case of possible cracking of HAp coating. Surface morphology of deposited layers, crystallographic texture and residual stress were studied in relation to the type of laser applied to ablation (Nd:YAG or ArF excimer), laser repetition, temperature of substrate and atmosphere in the reactive chamber.

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Abstract

In this work studies ofM OVPE growth of InAlGaAs/AlGaAs/GaAs heterostructures are presented. The HRXRD and SIMS measurements indicate the high structural and optical properties as well as high uniformity oft hickness and composition ofI nAlGaAs quantum wells. This work is the .rst step towards elaboration oft he technology oft he strained InAlGaAs/GaAs heterostructures for advanced optoelectronic devices working in the visible part oft he spectrum. The investigations ofSi (n-type), Zn (p-type) .-doped GaAs epilayers and centre Si-.-doped InxGa1-xAs single quantum well (SQW) are presented. The .-doping layer was formed by SiH4 or DEZn introduction during the growth interruption. The electrical and optical properties oft he obtained structures were examined using C-V measurement, EC-V electrochemical pro.ler, Raman spectroscopy (RS), photore.ectance (PR) and photocurrent (PC) spectroscopies. Technology oft hick GaN layers grown on sapphire by HVPE is very promising as a part off reestanding GaN substrates manufacturing. Further works will be focused on the optimisation of growth, separating layers from substrates and surface polishing. The in.uence oft he growth parameters on the properties of( Ga, Al)N/Al2O3 and Mg dopant incorporation was studied.

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Abstract

This paper presents the results obtained from the structural re.nement of selected metals and alloys produced by severe plasticdeformation processes. Large levels of deformations were produced using four methods, which di.ered in the character and dynamics of the loading, as well as in the intensity and homogeneity oft he plastic strain .eld. Qualitative and quantitative studies of the re.ned microstructure were carried out using stereological and computer image analytical methods. Microhardness and selected mechanical properties, such as strength and yield point, were also determined.

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Abstract

Pulse electrochemical machining (PECM) provides an economical and e.ective method for machining high strength, heat-resistantmaterials into complex shapes such as turbine blades, die, molds and micro cavities. Pulse Electrochemical Machining involves the application of a voltage pulse at high current density in the anodic dissolution process. Small interelectrode gap, low electrolyte .ow rate, gap state recovery during the pulse o.-times lead to improved machining accuracy and surface .nish when compared with ECM using continuous current. This paper presents a mathematical model for PECM and employs this model in a computer simulation of the PECM process for determination of the thermal limitation and energy consumption in PECM. The experimental results and discussion of the characteristics PECM are presented.

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Abstract

There is a growing need for a more accurate assessment of the load carrying capacity of highway bridges. The traditional approach is based on consideration of individual components rather than structures. Consequently, the acceptance criteria are formulated in terms of the allowable stress, or ultimate moment, in a component. However, it has been observed that the load carrying capacity of the whole structure (system) is often much larger than what is determined by the design of components. The difference can be attributed to the system behaviour. Quantification of this difference is the subject of the system reliability. There is a need to take advantage of the available system reliability methods and advanced structural analysis methods and apply them in the design of bridges and evaluation of existing structures. The current advanced analytical procedures allow for a numerically accurate but deterministic analysis of strain/stress in a bridge. Mathematical procedures exist for the calculation of reliability for various idealized systems: parallel, series, and combinations. There are also new developments in materials, technology, and field testing which can be used to improve bridge design and evaluation. This paper deals with calculation of the reliability of the whole bridge structure, taking into account realistic boundary conditions, and site-specific load and resistance parameters.

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Abstract

This paper presents revised and extended version of theory proposed in the late 1970-ties by A. ˇCyras and his co-workers. This theory, based upon the notion of duality in mathematical programming, allows us to generate variational principles and to investigate existence and uniqueness of solutions for the broad class of problems of elasticity and plasticity. The paper covers analysis of solids made of linear elastic, elastic-strain hardening, elastic-perfectly plastic and rigid-perfectly plastic material. The novelty with respect to ˇCyras’s theory lies in taking into account loads dispersed over the volume and displacements enforced on the part of surface. A new interpretation of optimum load for a rigid-perfectly plastic body is also given.

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Abstract

The second part of the paper presents finite-dimensional models of linear elastic, elastic-strain hardening, elastic-perfectly plastic

and rigid-perfectly plastic structures. These models can be seen as a result of discretisation procedure applied to the models of solids derived in the Part I. The implications of sub-dividing degrees of freedom into those with prescribed external forces and those with given displacements are discussed. It is pointed out that the dual energy principles given in this part of the paper can serve as a direct basis for numerical computations.

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Abstract

The notion of the normal transfer matrix and the notion of the structure decomposition of normal transfer matrix for 2D general model are introduced. Necessary and sufficient conditions for the existence of the structure decomposition of normal transfer matrix are established. A procedure for computation of the structure decomposition is proposed and illustrated by the numerical example. It is shown that the impulse response matrix of the normal model is independent of the polynomial part of its structure decomposition.

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Abstract

One of the main problems of electrical power quality is to ensure a constant power ?ux from the supply system to the receiver, keeping in the same time the undisturbed wave form of the current and voltage signals. Distortion of signals are caused by nonlinear or time varying receivers, voltage changes or power losses in a supply system. The wave-form of the voltage of the source may also be deformed. This study seeks the optimal current and voltage wave-form by means of an optimization criteria. The optimization problem is de?ned in Hilbert space and the special functionals are minimized. The source inner impedance operator is linear and time-varying. Some examples of calculations are presented.

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Editorial office

Editor-in-Chief:

T. Kaczorek, Warsaw University of Technology

Deputy Editor-in Chief:

M.P. Kazmierkowski, Warsaw University of Technology
A. Rogalski, Division IV Technical Sciences PAN

Board of Co-editors:

Artificial and Computational Intelligence
S. Osowski and B. Sawicki, Warsaw University of Technology


BiomedicalEngineering and Biotechnology
A. Liebert and R. Maniewski, Institute of Biocybernetics and Biomedical Engineering PAN

 

Civil Engineering
L. Czarnecki, Building Research Institute, ITB, Warsaw


Control,Robotics and Informatics
J. Klamka and A. Babiarz, Silesian Technical University

A. Borkowski, Institute of Fundamental Technological Research PAN

Electronics, Telecommunication and Optoelectronics
M. Mrozowski and A. Lamęcki, Gdansk University of Technology

W. Woliński, Warsaw University of Technology


Mechanical and Aeronautical Engineering, Thermodynamics
A. Styczek, and A. Tylikowski, Warsaw University of Technology


MaterialsScience and Nanotechnology
B. Major and P. Czaja, Institute of Metallurgy and Materials Science PAN
T.A. Kowalewski and B. Blachowski, Institute of Fundamental Technological Research PAN

PowerSystems and Power Electronics
M.P. Kazmierkowski, Warsaw University of Technology

International Editorial Advisory Board

I.V. Alexandrov, Ufa State Aviation Technical University, Russia
R. Asthana, University of Wisconsin-Stout, Menomonie, USA
Xu Binshi, China Association of Plant Engineering, Beijing, P.R. China
F. Blaabjerg, Aalborg University, Denmark

C. Cecati, University of L’Aquila, Italy

A. Cichocki, RIKEN Institute, Tokyo, Japan

M. David, National Polytechnique de Toulouse, France
R. Ebner, Materials Centre Leoben, Leoben, Austria
E. Fornasini, University of Padova, Padova, Italy

L.G. Franquelo, University of Seville, Spain

M. Gad-el-Hak, Virginia Commonwealth University, Richmond, USA

D. van Gemert, Catholic University Leuven, KU Leuven, Belgium

L. Keviczky, Hungarian Academy of Sciences, Budapest, Hungary
V. Kučera, Czech Technical University in Prague, Prague, Czech Republic

R. Kennel, Technical University Munich, Germany

E. Levi, Liverpool John Moore University, UK
G. Maier, Technical University of Milan, Milan, Italy

K.F. Man, City University of Hong Kong,
H.A. Mang
, Austrian Academy of Sciences, Vienna, Austria
H. Mihashi, Tohoku University, Aoba-ku, Sendai, Japan
S. Mindess, University of British Columbia, Vancouver, Canada
D.A. Mlynski, University of Karlsruhe, Karlsruhe, Germany
A.S. Nowak, University of Michigan, Ann Arbor, USA

K. Ohnishi, Keio University, Yokohama, Japan
A. Öberg, Linköping University, Linköping, Sweden

W. Pedrycz, University of Alberta, Canada
S. Przemieniecki, University of South Florida, Tampa, USA
M. Razeghi, Northwestern University, Evanston, USA
J. Rodriguez, Technical University of Federico Santa Maria, Valparaiso, Chile
J.V. Sloten, Catholic University Leuven, Leuven, Belgium

B.M. Wilamowski, University of Auburn, Alabama, USA
W. Włosiński, Warsaw University of Technology, Warsaw, Poland
A.L. Yarin, University of Illinois at Chicago, USA

Du Xiangwan, Chinese Academy of Engineering, China
J. Żurada, Department of Computer Engineering, University of Louisville, USA

Contact

Editorial Office:
Pałac Kultury i Nauki,
Wydział IV PAN,
PL 00-901 Warszawa
tel.: +48(22) 182 60 45
Mrs Ewa Trojanowska
e-mail: bulletinpas.et@gmail.com

Instructions for authors

About the Journal

The Bulletin of the Polish Academy of Sciences: Technical Sciences (Bull.Pol. Ac.: Tech.) is published by the Division IV Engineering Sciences of the Polish Academy of Sciences. The journal is peer‐reviewed and is published both in printed and electronic form (
http://czasopisma.pan.pl/dlibra/journal/95347).It is established for the publication of original high quality papers from multidisciplinary Engineering sciences with the following topics preferred:

• Artificial and Computational Intelligence,
• Biomedical Engineering and Biotechnology,
• Civil Engineering,
• Control, Informatics and Robotics,
• Electronics, Telecommunication and Optoelectronics,
• Mechanical and Aeronautical Engineering, Thermodynamics,
• Material Science and Nanotechnology,
• Power Systems and Power Electronics.

 

General data:

 

Format of the journal – A4 printed and electronic form,

Paper type – thick (chalk overlay) paper,

Colourfulness – full colour at an extra charge,

The volume of the journal – 250 pages (ca 30 papers) + 4 cover pages,

Frequency of publication – quarterly,

ISSN: 0239-7528 (print version),

ISSN: 2300-1917 (on line version),

DOI: 10.24425/bpasts

 

Abbreviations/Acronym:

 

Journal citation: Bull. Pol. Ac.: Tech.

ISO: Bull. Pol. Acad. Sci.-Tech. Sci.,

JCR Abbrev: B POL ACAD SCI-TECH

Acronym in the Editorial System: BPASTS

 

Journal Metrics:

 

JCR Impact Factor 2018:                                                                 1.361

5 Year Impact Factor: 1.323
SCImago Journal Rank (SJR) 2017:                                                 0.319
Source Normalized Impact per Paper (SNIP) 2017:                     1.005
CiteScore 2017:                                                                              1.27

The Polish Ministry of Science and Higher Education 2017:      25 points

Manuscript types:

Invited reviews presenting the state of the knowledge and/or devoted to novel topics,
• Refereed research papers reporting on original scientific or technological achievements,
• Refereed papers in special issues/sections serving as conference proceedings arranged by guest editors.

 

Submission Policy

 

All manuscripts submitted for publication should be original. Manuscripts published or under consideration for publication elsewhere should not be submitted and will not be considered. Submission of a paper implies that it has not been published previously, that it is not under consideration for publication elsewhere, a, nd that if accepted it will not be published elsewhere in the same form, in English or in any other language, without the written consent of the Publisher.

 

 Manuscript submission for review


The Bull. Pol. Ac.: Tech is now employing a Web-based manuscript submission and peer-review tracking system called Editorial System. Authors must submit their manuscript electronically on the web
http://www.editorialsystem.com/bpasts/. From this entry page, access can be obtained to all information required for the submission of a manuscript. First‐time users must create an Author’s account to obtain a user ID and password required to enter the system. All manuscripts receive individual identification codes that should be used in any correspondence with regard to the publication process. For the authors already registered in the Editorial System it is enough to enter their username and password to login as an author (Sign in). Author(s) will be notified about registration and manuscript review process by e-mail.
The manuscripts must be uploaded as a single PDF file.
If you experience difficulties with the manuscript submission website, please contact the Editorial Office of the Bull. Pol. Ac.: Tech (Mrs Ewa Trojanowska:
bulletinpas.et@gmail.com or Mrs Anna Jurkiewicz bulletinPAS@gmail.com).Names of authors and their affiliation should be removed from the manuscripts for the review process in order to have a fair evaluation of their manuscript. All authors of the manuscript are responsible for its content; they must have agreed to its publication and have given the corresponding author the authority to act on their behalf in all matters pertaining to publication. The Corresponding Author is responsible for informing the coauthors of the manuscript status throughout the submission, review, and production process.


 Manuscript preparation


1. The manuscript should be written in clear and concise English (UK version).

2. For manuscript preparation please use the Word or LaTeX template available in the Information for Authors on http://www.editorialsystem.com/bpasts/

3. Please remember, that in the .pdf version of the manuscript uploaded in the Editorial System for evaluation process, author(s) name(s) and affiliation should be removed.

4. Authors should consult a recent issue of the journal for style if possible.
 

Manuscript decision and Proofs:

Manuscript evaluations are assigned one of four outcomes: Accept, Minor Revisions, Major Revisions, and Reject. Manuscripts requiring "Minor Revision" not require a second review. All manuscripts receiving a "Major Revision" evaluation must be subjected to a second review. Rejected manuscripts are given no further consideration. Normally, manuscripts that receive a "Major Revision" decision have only one additional chance for revision and the revised version should be uploaded to the Editorial System within six weeks. If the author(s) failed to make satisfactory changes, the manuscript is rejected. On acceptance, manuscripts are subject to editorial amendment to suit house style.

Transfer of Copyright Agreement

Once the paper is initially accepted, the authors are assumed to have transferred the copyright of the paper to the publisher. Please fill the Form, available on the webpage
http://www.degruyter.com/view/supplement/s23001917_Open_Access_License.pdf

Sign it, and add to the final version of the manuscript as separate .pdf file.


Proofs will be sent to the author (first named author if no corresponding author is identified of multi-authored papers) and should be returned within48 hours of receipt.

Fees for printing the article

The Bulletin of the Polish Academy of Sciences: Technical Sciences (Bull.Pol. Ac.: Tech.) is published in Open Access, which means that all articles are available on the internet to all users immediately upon publication free of charge for the readers. Authors are invited so a declaration that they are ready to cover the costs of printing their article. In addition, each color page will be charged an additional fee according to the current cost of printing. Otherwise, the paper will be printed in black-white.

More details see in Information for Authors: http://www.editorialsystem.com/bpasts/

Open Access policy

The Bulletin of the Polish Academy of Sciences: Technical Sciences jest czasopismem wydawanym w wolnym dostępie na licencji CC BY-NC-SA 4.0.

The Bulletin of the Polish Academy of Sciences: Technical Sciences is an open access journal with all content available with no charge in full text version. The journal content is available under the licencse CC BY-NC-SA 4.

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