@article{Ciszewski_P._Processing_2020,
 author={Ciszewski, P. and Sochacki, M.},
 howpublished={online},
 year={2020},
 abstract={<p>
 The paper describes a research on assessing the quality of edges 
 resulting from the interaction of laser pulses with a material of rigid 
 and flexible printed circuits. A modern Nd:YVO4 crystal diode-pumped 
 solid-state laser generating a 532 nm wavelength radiation with a 
 nanosecond pulse time was used for the research. Influence of laser 
 parameters such as beam power and pulse repetition frequency on a heat 
 affected zone and carbonization was investigated. Quality and morphology 
 of laser-cut substrates were analyzed by optical microscopy. High 
 quality laser cutting of printed circuit board substrates was obtained 
 without delamination and surface damage, with a minimal carbonization 
 and heat affected zone. The developed process was implemented on the 
 printed circuit assembly line.
 </p>},
 title={Processing of printed circuit boards using a 532 nm green laser},
 type={Article},
 volume={vol. 28},
 number={No. 4},
 journal={Opto-Electronics Review},
 pages={197-202},
 publisher={Association of Polish Electrical Engineering and Polish Academy of Sciences in cooperation with Military University of Technology},
 doi={10.24425/opelre.2020.135258},
 keywords={laser cutting, flexible printed circuits, heat affected zone (HAZ)},
}