Details

Title

Physical Properties of Copper Based MMC Strengthened with Alumina

Journal title

Archives of Foundry Engineering

Yearbook

2014

Numer

No 2

Publication authors

Keywords

Metal matrix composite ; Copper ; Alumina particles ; Squeeze casting ; thermal conductivity ; Electrical conductivity

Divisions of PAS

Nauki Techniczne

Description

Archives of Foundry Engineering continues the publishing activity started by Foundry Commission of the Polish Academy of Sciences (PAN) in Katowice in 1978. The initiator of it was the first Chairman Professor Dr Eng. Wacław Sakwa – Corresponding Member of PAN, Honorary Doctor of Czestochowa University of Technology and Silesian University of Technology. This periodical first name was „Solidification of Metals and Alloys” , and made possible to publish the results of works achieved in the field of the Basic Problems Research Cooperation. The subject of publications was related to the title of the periodical and concerned widely understand problems of metals and alloys crystallization in a casting mold. In 1978-2000 the 44 issues have been published. Since 2001 the Foundry Commission has had patronage of the annually published “Archives of Foundry” and since 2007 quarterly published “Archives of Foundry Engineering”. Thematic scope includes scientific issues of foundry industry:

  • Theoretical Aspects of Casting Processes,
  • Innovative Foundry Technologies and Materials,
  • Foundry Processes Computer Aiding,
  • Mechanization, Automation and Robotics in Foundry,
  • Transport Systems in Foundry,
  • Castings Quality Management,
  • Environmental Protection.

Abstract

The aim of this work is the development of Cu-Al2O3 composites of copper Cu-ETP matrix composite materials reinforced by 20 and 30

vol.% Al2O3 particles and study of some chosen physical properties. Squeeze casting technique of porous compacts with liquid copper

was applied at the pressure of 110 MPa. Introduction of alumina particles into copper matrix affected on the significant increase of

hardness and in the case of Cu-30 vol. % of alumina particles to 128 HBW. Electrical resistivity was strongly affected by the ceramic

alumina particles and addition of 20 vol. % of particles caused diminishing of electrical conductivity to 20 S/m (34.5% IACS). Thermal

conductivity tests were performed applying two methods and it was ascertained that this parameter strongly depends on the ceramic

particles content, diminishing it to 100 Wm-1K-1 for the composite material containing 30 vol.% of ceramic particles comparing to 400

Wm-1K-1 for the unreinforced copper. Microstructural analysis was carried out using SEM microscopy and indicates that Al2O3 particles

are homogeneously distributed in the copper matrix. EDS analysis shows remains of silicon on the surface of ceramic particles after

binding agent used during preparation of ceramic preforms.

Publisher

The Katowice Branch of the Polish Academy of Sciences

Date

2014

Type

Artykuły / Articles

Identifier

ISSN 2299-2944

DOI

10.2478/afe-2014-0042

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