Szczegóły

Tytuł artykułu

Effects Of Nickel On The Microstructure And The Mechanical Properties Of Sn-0.7Cu Lead-Free Solders

Tytuł czasopisma

Archives of Metallurgy and Materials

Rocznik

2015

Numer

No 2 June

Autorzy

Wydział PAN

Nauki Techniczne

Wydawca

Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Commitee on Metallurgy of Polish Academy of Sciences

Data

2015[2015.01.01 AD - 2015.12.31 AD]

Identyfikator

ISSN 1733-3490

Referencje

Moura (2012), Mater Chem Phys, 132. ; Gourlay (2010), J Electron Mater, 39, 56, doi.org/10.1007/s11664-009-0962-5 ; Silva (2013), J Electron Mater, 42, 179, doi.org/10.1007/s11664-012-2263-7 ; Ventura (2011), Acta Mater, 59. ; Ma (2009), J Mater Sci, 44. ; Nogita (2010), Intermetallics, 18, 145, doi.org/10.1016/j.intermet.2009.07.005 ; Rani (2013), J Mater Eng Perform, 22, 2359. ; Daly (2011), J Alloy Compd, 509. ; Wu (2002), J Electron Mater, 31, 928, doi.org/10.1007/s11664-002-0185-5 ; Bai (2008), J Electron Mater, 37, 1012, doi.org/10.1007/s11664-008-0445-0 ; Zhu (2007), Microelectron Eng, 84. ; Pang (2012), Lead Free Solder and Reliability New York, Mechanics. ; Felberbaum (2011), JOM, 52, doi.org/10.1007/s11837-011-0175-2 ; Zeng (2011), J Mater Sci, 22, 565. ; Gourlay (2011), Acta Mater, 59. ; Wu (2002), J Electron Mater, 31, 442, doi.org/10.1007/s11664-002-0098-3 ; Huh (2002), Mater Trans, 43, 239, doi.org/10.2320/matertrans.43.239

DOI

10.1515/amm-2015-0151

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