Details

Title

Investigation Of Intermetallic Compounds In Sn-Cu-Ni Lead-Free Solders

Journal title

Archives of Metallurgy and Materials

Yearbook

2015

Issue

No 2 June

Authors

Divisions of PAS

Nauki Techniczne

Publisher

Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences

Date

2015[2015.01.01 AD - 2015.12.31 AD]

Identifier

DOI: 10.1515/amm-2015-0163 ; e-ISSN 2300-1909

Source

Archives of Metallurgy and Materials; 2015; No 2 June

References

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