Szczegóły

Tytuł artykułu

Vapordynamic thermosyphon – heat transfer two-phase device for wide applications

Tytuł czasopisma

Archives of Thermodynamics

Rocznik

2015

Numer

No 4 December

Autorzy publikacji

Wydział PAN

Nauki Techniczne

Wydawca

The Committee on Thermodynamics and Combustion of the Polish Academy of Sciences

Data

2015[2015.01.01 AD - 2015.12.31 AD]

Identyfikator

ISSN 1231-0956 ; eISSN 2083-6023

Referencje

GarnerS (2001), Loop thermosyphons and their applications to high density electronics cooling The Pacific Rim ASME Int Electronic Packaging Techn Hawaii, Conf, 01. ; KhodabandehR (2005), Pressure drop in riser and evaporator in an advanced two - phase thermosyphon loop, Int J Refrig, 28, 725, doi.org/10.1016/j.ijrefrig.2004.12.003 ; VasilievL (2012), Heat transfer enhancement in mini channels with micro / nano particles deposited on a heat - loaded wall, Enhanc Heat Transf, 19, 13, doi.org/10.1615/JEnhHeatTransf.2011003350 ; VasilievL (2004), Vaporization heat transfer in porous wicks of evaporators, Arch Thermodyn, 25, 47. ; PossamaiF (2009), Miniature heat pipe as compressor cooling devices, Appl Therm Eng, 29, 3218, doi.org/10.1016/j.applthermaleng.2009.04.030 ; AliakhnovichV (2011), Cooling system for hermetic compressor based on the loop thermosyphon In th Minsk Int Heat Pipes , Heat Pumps Refrigerators, Proc Power Sources, 9, 101. ; KhrustalevD (2002), Loop thermosyphons for cooling of electronics In th Semi - therm Symposium, Proc, 18, 145. ; MilanezF (2010), Heat transfer limit due to pressure drop of a two - phase loop thermosyphon Heat Pipe, Sci Technol, 1, 237. ; DubeV (2004), The effects of non - condensable gases on the performance of loop thermosyphon heat exchangers, Appl Therm Eng, 24, 2439, doi.org/10.1016/j.applthermaleng.2004.02.013

DOI

10.1515/aoter-2015-0033

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