Details

Title

The Influence of Mg Additive on the Structure and Electrical Conductivity of Pure Copper Castings

Journal title

Archives of Foundry Engineering

Yearbook

2017

Volume

vol. 17

Numer

No 4

Publication authors

Keywords

Solidification Process ; Primary grains ; Pure copper ; Castings ; Mg additive ; Electrical conductivity

Divisions of PAS

Nauki Techniczne

Publisher

The Katowice Branch of the Polish Academy of Sciences

Date

2017

Type

Artykuły / Articles

Identifier

ISSN 2299-2944

References

Schlesinger (2011), Chapter Melting Casting In th ed, Metall, 20, 397. ; Vincent (2012), Effect of porosity on the thermal conductivity of copper processed by powder metallurgy, Phys Chem Solids, 73. ; Li (2011), The Effect of Pore Structure on the Electrical Conductivity of Ti Porous Media, null, 16, 87. ; Górny (2011), Copper and copper alloys with high conductivity, null. ; (2001), Speciality Handbook Copper copper alloys, International, 1. ; Chen (2011), Dependence of texture evolution on initial orientation in drawn single crystal copper, Mater Charact, 23, 237. ; Bydałek (2000), The rational principle of the copper alloys refining Solidif Met Alloy, null, 28, 65. ; Fu (2011), Study of ultrahigh - purity copper billets refined by vacuum melting and directional solidification Rare Met, null, 12, 304. ; Gu (null), Grain size dependent texture evolution in severely rolled pure copper, Mater Charact, 18, 2015. ; Zhang (2008), Microstructural characteristics of largescale ultrafine - grained copper, Mater Charact, 22, 59. ; Miyajima (null), Dislocation density of pure copper processed by accumulative roll bonding and equalchannel angular pressing, Mater Charact, 19, 2015. ; Habibi (2011), grained pure copper with high - strength and highconductivity produced by equal channel angular rolling process, Nano Mater Process Technol, 211. ; Yamamura (2001), Evaluation of porosity in porous copper fabricated by unidirectional solidification under pressurized hydrogen, Mater Sci Eng, 13, 318. ; Kuhn (2012), Properties of High Performance Alloys for Electromechanical Connectors in Alloy Early Perform Enhancing, Appl Curr Process InTech, 26, 51. ; (2010), Pure copper processed by extrusion preceded equal channel angular pressing, Mater Charact, 20, 61. ; Rzadkosz (2009), Influence of refining operations on a structure and properties of copper and its selected alloys, Arch Metall Mater, 30, 299. ; Ẑitňanský (1995), Refining of the Copper and investment casting, Mater Process Technol, 11, 53. ; Bonderek (2000), The phenomena of porosity in castings made of aluminium and magnesium Met Alloy, alloys, 51. ; Konečná (2012), Copper Copper Alloys Casting Classification Characteristic Microstructures in Alloy Early Perform Enhancing, Appl Curr Process InTech, 27, 3. ; Elsayed (2013), Sin Inclusions in magnesium and its alloys a, review Int Mater Rev, 14, 419. ; Shahzeydi (2016), The distribution and mechanism of pore formation in copper foams fabricated by Lost Carbonate method, Sintering Mater Charact, 15, 111. ; Benchabane (2008), Recrystallization of pure copper investigated by calorimetry and microhardness, Mater Charact, 21, 59. ; Hsu (1977), Impurity effects in highconductivity copper, JOM, 29, 21. ; Han (2014), Grain growth in ultrafine grain sized copper during cyclic deformation Alloys, null, 24, 615. ; Cuevas (2009), Electrical conductivity and porosity relationship in metal foams Porous, Mater, 17, 675. ; Han (2009), damage generation in ECAPed oxygen free copper Alloys, Fatigue, 25, 483. ; Rzadkosz (2013), Researching the Influence of Chemical Composition and Technological Parameters on the Quality of Copper Alloys Arch Foundry, Eng, 29, 153. ; Chung (null), Flash light sintered copper precursor / nanoparticle pattern with high electrical conductivity and low porosity for printed electronics Solid, Thin Films, 2015.

DOI

10.1515/afe-2017-0135

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