Details

Title

Effect of Electroless Ni–P Plating on the Bonding Strength of Bi–Te-Based Thermoelectric Modules

Journal title

Archives of Metallurgy and Materials

Yearbook

2017

Numer

No 2

Publication authors

Keywords

Metals and Alloys

Divisions of PAS

Nauki Techniczne

Abstract

<jats:title>Abstract</jats:title><jats:p>In the present study, electroless Ni–P plating was applied to Bi–Te-based thermoelectric materials as a barrier layer and the effect of the Ni–P plating on the bonding strength of the thermoelectric module was investigated. The bonding strength of the n- and p-type modules increased after being subjected to the electroless Ni–P plating treatment. In the case of the thermoelectric module that was not subjected to electroless Ni–P plating, Sn and Te were interdiffused and formed a brittle Sn–Te-based metallic compound. The shearing mostly occurred on the bonding interface where such an intermetallic compound was formed. On the other hands, it was found from the FE-EPMA analysis of the bonding interface of thermoelectric module subjected to electroless Ni-P plating that the electroless Ni-P plating acted as an anti-diffusion layer, preventing the interdiffusion of Sn and Te. Therefore, by forming such an anti-diffusion layer on the surface of the Bi–Te based thermoelectric element, the bonding strength of the thermoelectric module could be increased.</jats:p>

Publisher

Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Commitee on Metallurgy of Polish Academy of Sciences

Date

2017

Identifier

ISSN 1733-3490

DOI

10.1515/amm-2017-0182

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