Szczegóły

Tytuł artykułu

Meta-Stable Conditions of Diffusion Brazing

Tytuł czasopisma

Archives of Metallurgy and Materials

Rocznik

2011

Numer

No 2 June

Autorzy publikacji

Wydział PAN

Nauki Techniczne

Wydawca

Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Commitee on Metallurgy of Polish Academy of Sciences

Data

2011

Identyfikator

ISSN 1733-3490

Referencje

Tuah-Poku I. (1988), A Study of the Transient Liquid Phase Bonding Process Applied to a Ag/Cu/Ag Sandwich Joint, Metallurgical Transactions, 19A, 675. ; Kloch J. (2005), Morphological Characteristics of the Multi-layer/Substrate Systems, null, 375. ; Wołczyński W. (2006), Mass Transport during Diffusion Soldering or Brazing at the Constant Temperature, null, 12. ; Chuang Y. (1975), Kinetics of Diffusion Controlled Peritectic Reaction during Solidification of Iron-Carbon Alloys, Metallurgical Transactions, 6, A, 235. ; Jacobson D. (1992), Diffusion Soldering, Soldering & Surface Mount Technology, 10, 27, doi.org/10.1108/eb037777 ; Jiangwei R. (2002), Microstructure Characteristics in the Interface Zone of Ti/Al Diffusion Bonding, Materials Letters, 56, 647, doi.org/10.1016/S0167-577X(02)00570-0 ; Wołczyński W. (2006), Segregation Profiles in Diffusion Soldered Ni/Al/Ni Interconnections, Materials Science Forum, 508, 385, doi.org/10.4028/www.scientific.net/MSF.508.385 ; D. Kopyciński, Krystalizacja faz międzymetalicznych i cynku na żelazie oraz jego nisko- i wysokowęglowych stopach podczas procesu cynkowania. Monografia AGH, 149, Kraków 2006, 131 stron. ; Umeda T. (1996), Phase Selection during Solidification of Peritectic Alloys, Acta Materialia, 44, 4209, doi.org/10.1016/S1359-6454(96)00038-9 ; MacDonald W. (1998), Isothermal Solidification Kinetics of Diffusion Brazing, Metallurgical and Materials Transactions, 29A, 315, doi.org/10.1007/s11661-998-0183-1 ; Phelan D. (2006), Kinetics of the Peritectic Phase Transformation: In-situ Measurements and Phase Field Modelling, Metallurgical/Materials Transactions, 37A, 985, doi.org/10.1007/s11661-006-0071-5

DOI

10.2478/v10172-011-0035-7

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