Szczegóły

Tytuł artykułu

Cu Thin Films Deposited by DC Magnetron Sputtering for Contact Surfaces on Electronic Components

Tytuł czasopisma

Archives of Metallurgy and Materials

Rocznik

2011

Numer

No 4 December

Autorzy publikacji

Wydział PAN

Nauki Techniczne

Wydawca

Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Commitee on Metallurgy of Polish Academy of Sciences

Data

2011

Identyfikator

ISSN 1733-3490

Referencje

Copper in Electrical Contacts, CDA Publication <b>23</b> (1997). ; Volinsky A. (2001), Mater. Res. Soc. Symp, 649. ; A. Radisic, O. Luhn, H. G. G. Philipsen, Microelectronics Engineering, (2010), Article in press. ; Mermet J. (1995), J. Phys. IV, 05, C5, 517. ; Nevolin N. (2001), Laser Physics, 11, 7, 824. ; Gibson D. (2008), Society of Vacuum Coaters, 151, 505. ; Cztermastek H. (2004), O-ER, 12, 1, 49. ; Merchant M. (2001), JOM, 53, 6, 43, doi.org/10.1007/s11837-001-0103-y ; Swann S. (1988), Physics in Technology, 19, 67, doi.org/10.1088/0305-4624/19/2/304 ; Tyagi P. (2001), Bull. Mater. Sci, 24, 3, 297, doi.org/10.1007/BF02704925 ; Vopsaroiu M. (2005), Journal of Optoelectronics and Advanced Materials, 7, 5, 2713. ; Meier A. (2005), Measurment Techniques, 8, 5, 427, doi.org/10.1007/BF01001796 ; Culity B. (1978), Elements of X-ray Diffraction. ; Fuchs K. (1938), Proc. Cambridge Philos. Soc, 34, 100, doi.org/10.1017/S0305004100019952 ; Sondheimer E. (1952), Adv. Phys, 1, 1, doi.org/10.1080/00018735200101151 ; Mayadas A. (1970), Phys. Rev, B 1, 1382. ; Thomsen V. (2007), Basic Fundamental Parameters in X-Ray Fluorescence, Spectroscopy, 22, 5. ; Lim J. (2003), Applied Surface Science, 217, 95, doi.org/10.1016/S0169-4332(03)00522-1 ; Sun T. (2010), Phys. Rev, B 81, 155454, doi.org/10.1103/PhysRevB.81.155454 ; Paik N. (2005), Nuclear Instruments and Methods in Physics Research, B 229, 436, doi.org/10.1016/j.nimb.2004.12.123 ; Kucharska B. (2010), Archives of Metallurgy and Materials, 55, 1, 45.

DOI

10.2478/v10172-011-0099-4

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