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The increasing demands for miniaturization and better functionality of electronic components and devices have a significant effect on the requirements facing the printed circuit board (PCB) industry. PCB manufactures are driving for producing high density interconnect (HDI) boards at significantly reduced cost and reduced implementation time. The interconnection complexity of the PCB is still growing and today calls for 50/50 μm or 25/25 μm technology are real. Existing technologies are unable to offer acceptable solution. Recently the Laser Direct Imaging (LDI) technology is considered as an answer for these challenges. LDI is a process of imaging electric circuits directly on PCB without the use of a phototool or mask. Our laboratory system for Laser Direct Imaging is designed for tracks and spaces on PCB with minimum width distance of 50/50 μm. In comparison with conventional photolithography method, this technology is much better for 50/50 μm track and spaces. In our research we used photoresist with resolution 50 μm, but in case of using laser photoresists with better resolution (e.g. 25 μm) it will be possible to image tracks in super-fine-line technology (25/25 μm). The comparison between two technology of creating mosaic pattern tracks on PCB proved that laser imaging is promising technology in high density interconnects patterns, which are widely use in multilayered PCB and similar applications.
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