High heat flux removal are important issue in many perspective applications such as computer chips, laser diode arrays, or boilers working on supercritical parameters. Electronic microchips constructed nowadays are model example of high heat flux removal, where the cooling system have to maintain the temperature below 358 K and take heat flux up to 300 W/cm2. One of the most efficient methods of microchips cooling turns out to be the spray cooling method. Review of installations has been accomplished for removal at high heat flux with liquid sprays. In the article are shown high flux removal characteristic and dependences, boiling critical parameters, as also the numerical method of spray cooling analysis.
The pool boiling characteristics of dilute dispersions of alumina, zirconia and silica nanoparticles in water were studied. These dispersions are known as nanofluids. Consistently with other nanofluid studies, it was found that a significant enhancement in Critical Heat Flux (CHF) can be achieved at modest nanoparticle concentrations (<0.1% by volume). Buildup of a porous layer of nanoparticles on the heater surface occurred during nucleate boiling. This layer significantly improves the surface wettability, as shown by a reduction of the static contact angle on the nanofluid-boiled surfaces compared with the pure-water-boiled surfaces. CHF theories support the nexus between CHF enhancement and surface wettability changes. This represents a first important step towards identification of a plausible mechanism for boiling CHF enhancement in nanofluids.