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Warm Tensile Deformation Behavior and Constitutive Equation of Supersaturated Solid-Solutionized Al-9Mg Extruded Alloy

Seung Y. Yang Bong H. Kim Da B. Lee Kweon H. Choi Nam S. Kim Seong H. Ha Young O. Yoon Hyun K. Lim Shae Kim Young J. Kim
Archives of Metallurgy and Materials | 2021 | vol. 66 | No 4 | 1013-1018 | DOI: 10.24425/amm.2021.136416
Keywords Aluminum alloy Al-9Mg alloy Tensile test Constitutive equation
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Abstract

In this paper, as a purpose to apply the supersaturated solid-solutionized Al-9Mg alloy to the structural sheet parts of automotive, tensile tests were conducted under the various conditions and a constitutive equation was derived from the tensile test results. Al-9Mg alloy was produced using a special Mg master alloy containing Al2Ca during the casting process and extruded into the sheet. In order to study the deformation behavior of Al-9Mg alloy in warm temperature forming environments, tensile tests were conducted under the temperature of 373 K-573 K and the strain rate of 0.001/s~0.1/s. In addition, by using the raw data obtained from tensile tests, a constitutive equation of the Al-9Mg alloy was derived for predicting the optimized condition of the hot stamping process. Al-9Mg alloy showed uncommon deformation behavior at the 373 K and 473 K temperature conditions. The calculated curves from the constitutive equation well-matched with the measured curves from the experiments particularly under the low temperature and high strain rate conditions.
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Bibliography

[1] P.F. Bariani, S. Bruschi, A, Ghiotti, F. Michieletto, CIRP Annals 62, 251-254 (2013). DOI: https://doi.org/10.1016/j.cirp.2013.03.050
[2] B.-H. Lee, S.-H. Kim, J.-H. Park, H.-W. Kim, J.-C. Lee, Materials Science and Engineering: A 657, 115-122 (2016). DOI: https://doi.org/10.1016/j.msea.2016.01.089
[3] D. Li, A. Ghosh, Materials Science and Engineering: A 352, 279- 286 (2003). DOI: https://doi.org/10.1016/S0921-5093(02)00915-2
[4] N.-S. Kim, K.-H. Choi, S.-Y. Yang, S.-H. Ha, Y.-O. Yoon, B.-H. Kim, H.-K. Lim, S.K. Kim, S.-K. Hyun, Metals 11, 288 (2021). DOI: https://doi.org/10.3390/met11020288
[5] H. Wang, Y. Luo, P. Friedman, M. Chen, L. Gao, Transactions of Nonferrous Metals Society of China 22, 1-7 (2012). DOI: https://doi.org/10.1016/S1003-6326(11)61131-X
[6] D. Li, A.K. Ghosh, Journal of Materials Processing Technology 145, 281-293 (2004). DOI: https://doi.org/10.1016/j.jmatprotec.2003.07.003
[7] R .C. Picu, Acta Materialia 52, 3447-3458 (2004). DOI: https://doi.org/10.1016/j.actamat.2004.03.042
[8] C.-H. Cho, H.-W. Son, J.-C. Lee, K.-T. Son, J.-W. Lee, S.-K. Hyun, Materials Science and Engineering: A 779, 139151 (2020). DOI: https://doi.org/10.1016/j.msea.2020.139151
[9] S.-Y. Yang, D.-B. Lee, K.-H. Choi, N.-S. Kim, S.-H. Ha, B.- H. Kim, Y.-O. Yoon, H.-K. Lim, S.K. Kim, Y.-J. Kim, Metals 11, 410 (2021). DOI: https://doi.org/10.3390/met11030410
[10] Q. Dai, Y. Deng, H. Jiang, J. Tang, J. Chen, Materials Science and Engineering: A, 766, 138325 (2019). DOI: https://doi.org/10.1016/j.msea.2019.138325
[11] L. Hua, F. Meng, Y. Song, J. Liu, X. Qin, L. Suo, J. of Materi Eng and Perform 23, 1107-1113 (2014). DOI: https://doi.org/10.1007/s11665-013-0834-2
[12] Y.Q. Cheng, H. Zhang, Z.H. Chen, K.F. Xian, Journal of Materials Processing Technology 208, 29-34 (2008). DOI: https://doi.org/10.1016/j.jmatprotec.2007.12.095
[13] L.C. Tsao, H.Y. Wu, J.C. Leong, C.J. Fang, Materials & Design 34, 179-184 (2012). DOI: https://doi.org/10.1016/j.matdes.2011.07.060
[14] K.C. Chan, G.Q. Tong, Materials Letters 51, 389-395 (2001).
[15] https://www.sentesoftware.co.uk/site-media/flow-stress-curve
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Authors and Affiliations

Seung Y. Yang
1 2
ORCID: ORCID
Bong H. Kim
1
ORCID: ORCID
Da B. Lee
1
Kweon H. Choi
1
ORCID: ORCID
Nam S. Kim
1
ORCID: ORCID
Seong H. Ha
1
Young O. Yoon
1
Hyun K. Lim
1
ORCID: ORCID
Shae Kim
1
Young J. Kim
2
ORCID: ORCID
  1. Korea Institute of Industrial Technology, Advanced Process and Materials R&D Group, KITECH, 156 Gaetbeol Rd., Yeonsu-gu, Incheon, 21999, Korea
  2. Sungkyunkwan University, Advanced Materials Science & Engineering, SKKU, Suwon, Korea

Microstructure and Mechanical Properties of Hot-deformed AlMg4 Alloys with the Variations of Mn, Fe, and Si contents

Da B. Lee Bong H. Kim Kweon H. Choi Seung Y. Yang Nam S. Kim Seong H. Ha Young O. Yoon Hyun K. Lim Shae Kim Soong K. Hyun
Archives of Metallurgy and Materials | 2020 | vol. 65 | No 4 | 1255-1259 | DOI: 10.24425/amm.2020.133679
Keywords Al-Mg alloy intermetallic compounds homogenization hot-rolling microstructure
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Abstract

This paper aims to investigate the microstructural evolution and mechanical properties of hot-deformed AlMg4 alloys with Mn, Fe, and Si as the main impurities. For this purpose, solidification behavior and microstructural evolution during hot-rolling and heat-treatment processes are investigated by using theoretical calculations and experimental characterization. The crystallization and morphological transformation of intermetallic Al3Fe, Al6Mn, and Mg2Si phases are revealed and discussed in terms of the variation in chemical composition. Following a homogenization heat-treatment, the effect of heat treatment on the intermetallic compounds is also investigated after hot-rolling. It was revealed that the Mg2Si phase can be broken into small particles and spherodized more easily than the Al3Fe intermetallic phase during the hot-rolling process. For the Mn containing alloys, both yield and ultimate tensile strength of the hot-rolled alloys increased from 270 to 296 MPa while elongation decreased from 17 to 13%, which can be attributed to Mn-containing intermetallic as well as dispersoid.

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Authors and Affiliations

Da B. Lee
Bong H. Kim
ORCID: ORCID
Kweon H. Choi
ORCID: ORCID
Seung Y. Yang
ORCID: ORCID
Nam S. Kim
ORCID: ORCID
Seong H. Ha
Young O. Yoon
Hyun K. Lim
ORCID: ORCID
Shae Kim
Soong K. Hyun

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