Abstract
Development of electronics, which aims to improve the functionality of
electronic devices, aims at increasing the packing of transistors in a
chip and boosting clock speed (the number of elementary operations per
second). While pursuing this objective, one encounters the growing problem
of thermal nature. Each switching of the logic state at the elementary
level of an integrated circuit is associated with the generation of heat.
Due to a large number of transistors and high clock speeds, higher heat
flux is emitted by the microprocessor to a level where the component needs
to be intensively cooled, or otherwise it will become overheated. This
paper presents the cooling of microelectronic components using microjets.
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