In this paper, we have studied the evolution of morphology and brazing behavior of Ag-28Cu alloy filler processed by high energy ball milling. The milling of the powder mixture was carried out for 40 h. The structural and morphological analyses were performed by the X-ray diffraction and scanning electron microscopy. The melting temperature of the braze filler was determined by differential thermal analysis. The filler wetting properties were assessed from the spread area ratio measurements on various Ti substrates. The results indicate that the ball milling can effectively depress the filler melting point and enhance the brazeability. The milled powder mixture showed Ag(Cu) solid solution with a crystallite size of 174-68 nm after 40 h. It was shown that the high energy ball milling can be a potential method to develop low temperature brazing fillers for advanced microjoining applications.

In this study, we have developed Sn-Ag alloy by a simple high energy ball milling technique. We have ball-milled the eutectic mixture of Sn and Ag powders for a period of 45 h. The milled powder for 45 h was characterized for particle size and morphology. Microstructural investigations were carried out by scanning electron microscopy and X-ray diffraction studies. The melting behavior of 45 h milled powder was studied by differential scanning calorimetry. The resultant crystallite size of the Sn(Ag) solid solution was found to be 85 nm. The melting point of the powder was 213.6oC after 45 h of milling showing depression of ≈6oC in melting point as compared to the existing Sn-3.5Ag alloys. It was also reported that the wettability of the Sn-3.5Ag powder was significantly improved with an increase in milling time up to 45 h due to the nanocrystalline structure of the milled powder.