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Abstract

The study investigates the effect of heat treatment on the microstructure evolution and properties of an age-hardened ­Cu-3Ti-2Mg alloy. The precipitated Cu2Mg and β'-Cu4Ti phases consequently yield a depletion of the Cu matrix in regards to Ti and Mg solutes, which enhances the electrical conductivity. The Cu2Mg Laves phase and β'-Cu4Ti phase precipitates increase the hardness of the alloy due to the consistency and coherency of the later phase. However, the decrease of hardness is mainly associated with the coarse microstructures, that can be formed due to the phase transformation from metastable β'-Cu4Ti phase to more stable Cu3Ti phase. In the range of experiments, the optimum process is solution treatment at 700°C for 4 h, with subsequent age-hardening at 450°C for 4 h. The electrical conductivity, hardness, tensile strength, and elongation of the Cu-3Ti-2Mg alloy were 15.34 %IACS, 344 HV, 533 MPa, and 12%, respectively.

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Authors and Affiliations

Jituo Liu
ORCID: ORCID
Xianhui Wang
ORCID: ORCID
Jia Liu
ORCID: ORCID
Qianni Ran
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Abstract

The phase transformation dynamic and electrical conductivity equations of the aged Cu-2.7Ti-2.5Ni-0.8V alloy were established in this work. The microstructure evolution and precipitated phases were characterized by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The mechanical properties were tested using a hardness testing machine and universal test machine, and the electrical conductivity was measured by the eddy conductivity gauge. The results show that NiTi intermetallic compounds are formed during the solidification, and these phases such as Ni3Ti and NiV3 are precipitated after aging treatment. The fracture morphology displays that a large number of shallow and equiaxed dimples occur on the tensile fracture, indicating a typical ductile fracture. After aging treatment at 450°C for 240 min, the hardness, tensile strength, elongation and electrical conductivity of the Cu-2.7Ti-2.5Ni-0.8V alloy are 184 HV, 459 MPa, 6.3% and 28.72% IACS, respectively.
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Authors and Affiliations

Jia Liu
1 2
ORCID: ORCID
Jituo Liu
3
ORCID: ORCID
Xianhui Wang
3
ORCID: ORCID

  1. Xi’an Polytechnic University, School of Materials Science and Engineering, Xi’an 710048, P.R. China
  2. Xi’an University of Technology, School of Mechanical and Precision Instrument Engineering, Xi’an 710048, P. R. China
  3. Xi’an University of Technology, School of Materials Science and Engineering, Xi’an 710048, P. R. China
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Abstract

To clarify the effect of copper powder morphology on the microstructure and properties of copper matrix bulk composites reinforced with Ni-doped graphene, spherical and dendritic copper powders were selected to fabricate the Ni-doped graphene reinforced copper matrix bulk composites. The Ni-doped graphene were synthesized by hydrothermal reduction method, followed by mixing with copper powders, and then consolidated by spark plasma sintering. It is found that the Ni-doped graphene are well bonded with the dendritic copper powder, whereas Ni-doped graphene are relatively independent on the spherical copper powder. The copper base bulk composite prepared by the dendritic copper powder has better properties than that prepared by spherical copper powder. At 0.5wt.% Ni-doped graphene, the dendritic copper base bulk composite has a good combination of hardness, electrical conductivity and yield strength, which are 81.62 HV, 87.93% IACS and 164 MPa, respectively.
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Authors and Affiliations

Jituo Liu
1
ORCID: ORCID
Xianhui Wang
1
ORCID: ORCID
Jia Liu
2
ORCID: ORCID
Hangyu Li
1
Yan Liang
1
ORCID: ORCID
Jingyi Ren
1
ORCID: ORCID

  1. Xi’an University of Technology, School of Materials Science and Engineering, Xi’an 710048, P.R. China
  2. Xi’an Polytechnic University, School of Materials Science and Engineering, Xi’an 710048, P.R. China

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