The high-pressure torsion (HPT) of Ti-Fe alloys with different iron content has been studied at 7 GPa, 5 anvil rotations and rotation speed of 1 rpm. The alloys have been annealed before HPT in such a way that they contained different amounts of α/α' and β phases. In turn, the β phase contained different concentration of iron. The 5 anvil rotations correspond to the HPT steady-state and to the dynamic equilibrium between formation and annihilation of microstructure defects. HPT leads to the transformation of initial α/α' and β-phases into mixture of α and high-pressure ω-phase. The α → ω and β → ω phase transformations are martensitic, and certain orientation relationships exist between α and ω as well as β and ω phases. However, the composition of ω-phase is the same in all samples after HPT and does not depend on the composition of β-phase (which is different in different initial samples). Therefore, the martensitic (diffusionless) transformations are combined with a certain HPT-driven mass-transfer. We observed also that the structure and properties of phases (namely, α-Ti and ω-Ti) in the Ti – 2.2 wt. % Fe and Ti – 4 wt. % Fe alloys after HPT are equifinal and do not depend on the structure and properties of initial α'-Ti and β-Ti before HPT.

In this study a two-step short wet etching was implemented for the black silicon formation. The proposed structure consists of two steps. The first step: wet acidic etched pits-like morphology with a quite new solution of lowering the texturization temperature and second step: wires structure obtained by a metal assisted etching (MAE). The temperature of the process was chosen due to surface development control and surface defects limitation during texturing process. This allowed to maintain better minority carrier lifetime compared to etching in ambient temperature. On the top of the acidic texture the wires were formed with optimized height of 350 nm. The effective reflectance of presented black silicon structure in the wavelength range of 300-1100 nm was equal to 3.65%.

The ethylene vinyl acetate (EVA) is widely used for solar modules encapsulation. During lamination process EVA melts and chemical bonds between polymer chains are created. Its number is tightly related to cross-linking degree and it is consider as a major quality reference for module encapsulation. The lamination can be described as a process with two stages: melting and curing where the typical temperature for curing is in the range from 145 to 175°C. In the present study, for the first time, comparison of three commercial available EVA foils with low curing temperature EVA (EVA LOW). For this reason, the temperature of following lamination processes was set from a range from 115 to 175°C. The behavior of cured EVA films under investigation EVA was determined with two approaches: with extraction and with optical methods. The results indicate the applicability of these methods for the EVA cross-linking characterization. Finally, the extraordinary behavior of EVA LOW foil was noticed.

A Cu-1Cr-0.1Zr alloy has been subjected to ECAP processing via route Bc and aging at 250-800°C. Electron BackScatter diffraction (EBSD), Transmission Electron Microscopy (TEM) and X-Ray Diffraction Line Profile Analysis (XRDLPA) techniques have been used to unveil some peculiarities of the grain and subgrain structure with a special emphasis on the comparison of the grain size estimated by the three techniques. For the alloy ECAP processed and aged up to 16 passes, the grain size (from EBSD, 0.2 < d < 5 μm), subgrain size (from TEM, d ~ 0.75 μm) and “apparent” average crystallite size (from XRDLPA, d < 0.25 μm) are manifestly different. The results were compared to the published data and analyzed based on the fundamental aspects of these techniques.