The Copper-SiC composite was investigated with the help of FEM. The authors modeled and analyzed the effect of relaxation of thermal stresses due to seasoning at room temperature after the manufacturing process together with the effect of thermal stresses induced by reheating the material to a service temperature. Especially, hypothetical fracture at interface was of interest. It was shown that, for a fixed temperature, a single crack emanating at 0° or 45° azimuth would develop only along a portion of fiber perimeter, and a further growth would require stress increase in the fiber surrounding.