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Abstract

The paper presents general information on LTCC materials, manufacturing processes and properties of fired modules. A Multichip Module package has been the main application of Low Temperature Cofired Ceramic (LTCC) technology. Recently, this technology is also used for production of sensors, actuators and microsystems. The research and development on the LTCC sensors and microsystems carried out in the Laboratory of Thick Film Microsystems at Wroclaw University of Technology are presented. LTCC microfluidic system is described in detail. Moreover, a short information is given on other LTCC applications .

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Authors and Affiliations

L.J. Golonka

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