This article deals with the technology and principles of the laser cutting of ductile cast iron. The properties of the CO2laser beam, input parameters of the laser cutting, assist gases, the interaction of cut material and the stability of cutting process are described. The commonly used material (nodular cast iron - share of about 25% of all castings on the market) and the method of the laser cutting of that material, including the technological parameters that influence the cutting edge, are characterized. Next, the application and use of this method in mechanical engineering practice is described, focusing on fixing and renovation of mechanical components such as removing the inflow gate from castings with the desired quality of the cut, without the further using of the chip machining technology. Experimental samples from the nodular cast iron were created by using different technological parameters of laser cutting. The heat affected zone (HAZ), its width, microstructure and roughness parameter Pt was monitored on the experimental samples (of thickness t = 13 mm). The technological parameters that were varied during the experiments included the type of assist gases (N2and O2), to be more specific the ratio of gases, and the cutting speed, which ranged from 1.6 m/min to 0.32 m/min. Both parameters were changed until the desired properties were achieved.

The paper describes a research on assessing the quality of edges resulting from the interaction of laser pulses with a material of rigid and flexible printed circuits. A modern Nd:YVO4 crystal diode-pumped solid-state laser generating a 532 nm wavelength radiation with a nanosecond pulse time was used for the research. Influence of laser parameters such as beam power and pulse repetition frequency on a heat affected zone and carbonization was investigated. Quality and morphology of laser-cut substrates were analyzed by optical microscopy. High quality laser cutting of printed circuit board substrates was obtained without delamination and surface damage, with a minimal carbonization and heat affected zone. The developed process was implemented on the printed circuit assembly line.