Micro-channel heat sinks are used in a wide variety of applications, including microelectronic devices, computers and high-energy-laser mirrors. Due to the high power density that is encountered in these devices (the density of delivered electrical power up to a few kW/cm2) they require efficient cooling as their temperatures must generally not exceed 100 ◦C. In the paper a new design for micro-channel heat sink (MCHS) to be used for cooling laser diode arrays (LDA) is considered. It is made from copper and consisting of 37 micro-channels with length of 9.78 mm, width of 190 μm and depth of 180 μm with the deionized water as a cooling medium. Mathematical and numerical models of the proposed design of the heat sink were developed. A series of thermofluid numerical simulations were performed for various volumetric flow rates of the cooling medium, its inlet temperature and different thermal power released in the laser diode. The results show that the LDA temperature could be decreased from 14 to 17% in comparison with earlier proposed design of the heat sink with the further drop in temperature obtained by applying indium instead of gallium arsenide as the soldering material between the LDA and MCHS interface. Moreover, it was found that the maximum temperature, and therefore the thermal resistance of the considered heat sink, could be decreased by increasing the coolant flow rate.

The effect of modifications in epi-side (top) gold metallization on a thermal performance and on power roll-over of blue-vio- let III-N-based p-up edge-emitting ridge-waveguide laser diode (RW EEL) was explored in this paper. The calculations were carried out using a two-dimensional self-consistent electrical-thermal model combined with a simplified optical model tuned to a RW EEL fabricated in the Institute of High Pressure Physics (Unipress). Our results suggest that with proper modifica- tions in the III-N-based RW EEL, excluding modifications in its inner structure, it is possible to considerably improve the thermal performance and, thus, increase the maximal output power.

A variety of optoelectronic devices (rangefinders, velocity meters, terrestrial scanners, lidars, free space optics communication systems and others) based on semiconductor laser technology feature low−quality and highly asymmetric beams. It results from optical characteristics of the applied high−peak−power pulsed laser sources, which in most cases are composed of several laser chips, each containing one or a few active lasers. Such sources cannot be considered as coherent, so the resultant beam is formed by the superposition of many optically uncorrelated sub-sources. Far−field distribution of laser spots in such devices corresponds to the shape of laser emitting area, which instead of desired symmetry shows layout composed of one or several discrete lines or rectangles. In some applications, especially if small targets are concerned, it may be crucial to provide more symmetrical and uniform laser beam cross−section. In the paper, the novel strategy of such correction, combining coherent and incoherent approaches, is presented. All aspects of technological implementations are discussed covering general theoretical treatment of the problem, diffractive optical element (DOE) design in the form of computer generated hologram (CGH), its fabrication and testing in case of selected laser module beam correction.

Vehicular visible light communication is an emerging technology that allows wireless communication between vehicles or between vehicles and infrastructure. In this paper, a vehicular visible light communication system is designed using a non-return to zero on-off keying modulation scheme under the effect of different weather conditions such as clear, haze, and fog. The first model is a light emitting diode-based system and the second is a laser diode-based system. For both models, the influence of system parameters such as beam divergence, transceiver aperture diameters, and receiver responsivity is studied. The impact of the use of the trans-impedance amplifier is also investigated for both models. It was concluded that in the presence of the amplifier, output power of the light emitting diode and laser diode model are increased by 98.46 µW and 0.4719 W, respectively. The performance of the two proposed models is evaluated through bit error rate, quality factor, eye diagram, and output power to have some insightful results about the quality of service for the two proposed models. Under a specific weather condition, the performance of the system would be critical and other techniques should be applied. The maximum achievable link distance for the laser-based and light-emitting diode-based systems is 190 m at a data rate of 25 Gbps and 80 m at a data rate of 60 kbps, respectively, under the same system parameters and weather conditions. The obtained results provide a full idea about the availability of constructing our proposed model in a practical environment, showing a higher performance of the laser diode-based model than that of the light emitting diode-based model.