@ARTICLE{Jun_Ho_Hwang_Transient_2017,
 author={Jun Ho Hwang and Lee, Jong-Hyun},
 volume={vol. 62},
 number={No 2},
 journal={Archives of Metallurgy and Materials},
 howpublished={online},
 year={2017},
 publisher={Institute of Metallurgy and Materials Science of Polish Academy of Sciences},
 publisher={Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences},
 title={Transient Liquid Phase Behavior of Sn-Coated Cu Particles and Chip Bonding using Paste Containing the Particles},
 URL={http://journals.pan.pl/Content/105095/PDF/10172-Volume62_Issue2-099_paper.pdf},
 doi={10.1515/amm-2017-0167},
}