@ARTICLE{Liu_Jituo_Influence_2022,
 author={Liu, Jituo and Wang, Xianhui and Liu, Jia and Li, Hangyu and Liang, Yan and Ren, Jingyi},
 volume={vol. 67},
 number={No 1},
 journal={Archives of Metallurgy and Materials},
 pages={341-348},
 howpublished={online},
 year={2022},
 publisher={Institute of Metallurgy and Materials Science of Polish Academy of Sciences},
 publisher={Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences},
 abstract={To clarify the effect of copper powder morphology on the microstructure and properties of copper matrix bulk composites reinforced with Ni-doped graphene, spherical and dendritic copper powders were selected to fabricate the Ni-doped graphene reinforced copper matrix bulk composites. The Ni-doped graphene were synthesized by hydrothermal reduction method, followed by mixing with copper powders, and then consolidated by spark plasma sintering. It is found that the Ni-doped graphene are well bonded with the dendritic copper powder, whereas Ni-doped graphene are relatively independent on the spherical copper powder. The copper base bulk composite prepared by the dendritic copper powder has better properties than that prepared by spherical copper powder. At 0.5wt.% Ni-doped graphene, the dendritic copper base bulk composite has a good combination of hardness, electrical conductivity and yield strength, which are 81.62 HV, 87.93% IACS and 164 MPa, respectively.},
 type={Article},
 title={Influence of Copper Powder Morphology on the Microstructure and Properties of Copper Matrix Bulk Composites Reinforced with Ni-doped Graphene},
 URL={http://journals.pan.pl/Content/122553/PDF-MASTER/AMM-2022-1-46-Wang.pdf},
 doi={10.24425/amm.2022.137764},
 keywords={Ni-doped graphene, copper base composite, copper powder morphology, mechanical properties},
}