TY - JOUR L1 - http://journals.pan.pl/Content/104983/PDF/10172-Volume62_Issue2-114_paper.pdf L2 - http://journals.pan.pl/Content/104983 PY - 2017 IS - No 2 DO - 10.1515/amm-2017-0182 A1 - Kim, S.S. A1 - Son, I. A1 - Kim, K.T. PB - Institute of Metallurgy and Materials Science of Polish Academy of Sciences PB - Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences VL - vol. 62 DA - 2017 T1 - Effect of Electroless Ni–P Plating on the Bonding Strength of Bi–Te-Based Thermoelectric Modules UR - http://journals.pan.pl/dlibra/publication/edition/104983 T2 - Archives of Metallurgy and Materials ER -