TY - JOUR N2 - The paper analyzes the phenomenon of heat transfer and its inertia in solids. The influence of this effect on the operation of an integrated circuit is described. The phenomenon is explained using thermal analogy implemented in the Spice environment by an R-C thermal model. Results from the model are verified by some measurements with a chip designed in CMOS 0.7 μm (5 V) technology. The microcontroller-based measurement system structure and experiment results are described. L1 - http://journals.pan.pl/Content/90227/PDF/Journal10178-VolumeXXI%20Issue1_11.pdf L2 - http://journals.pan.pl/Content/90227 PY - 2014 IS - No 1 EP - 120 DO - 10.2478/mms-2014-0011 KW - temperature KW - heat transfer KW - VLSI KW - electric analogy A1 - Frankiewicz, Maciej A1 - Gołda, Adam A1 - Kos, Andrzej PB - Polish Academy of Sciences Committee on Metrology and Scientific Instrumentation DA - 2014 T1 - INVESTIGATION OF HEAT TRANSFER IN INTEGRATED CIRCUITS SP - 111 UR - http://journals.pan.pl/dlibra/publication/edition/90227 T2 - Metrology and Measurement Systems ER -