Tytuł artykułu

The Effect Of Void Formation On The Reliability Of ED-XRF Measurements In Lead-Free Reflow Soldering

Tytuł czasopisma

Archives of Metallurgy and Materials

Rocznik

2015

Numer

No 2 June

Autorzy

Koncz-Horváth, D. ; Gergely, G. ; Z. Gácsi

Wydział PAN

Nauki Techniczne

Wydawca

Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences

Data

2015[2015.01.01 AD - 2015.12.31 AD]

Identyfikator

DOI: 10.1515/amm-2015-0150 ; e-ISSN 2300-1909

Źródło

Archives of Metallurgy and Materials; 2015; No 2 June

Referencje

Ghosh (1997), Acta Mater, 45, doi.org/10.1016/S1359-6454(96)00365-5 ; Alex (1996), on, IEEE Trans Man Tech, 19. ; Dudek (2010), Char, 61. ; Sharif (2004), Sci Eng, 106. ; Reilly (2007), Finish, 105. ; Amalu (2011), Eng, 88. ; Sherman (1955), Acta, 7. ; Bos (1998), Anal Chim Acta, 373. ; Harrison (2001), Surf Tech, 13. ; Lee (2002), Reflow Soldering Processes and Troubleshooting CSP and Flip Chip Technologies, Oxford. ; Zeng (2002), Mater Sci Eng, 38, doi.org/10.1016/S0927-796X(02)00007-4 ; Shangguan (2005), Lead - Free Solder Interconnect Reliability, USA. ; Biligiri (2007), Finish, 105.