Details

Title

Growth and Characterisation of Pulsed-Laser Deposited Tin Thin Films on Cube-Textured Copper at Different Temperatures

Journal title

Archives of Metallurgy and Materials

Yearbook

2016

Issue

No 2 June

Authors

Divisions of PAS

Nauki Techniczne

Publisher

Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences

Date

2016

Identifier

DOI: 10.1515/amm-2016-0174 ; e-ISSN 2300-1909

Source

Archives of Metallurgy and Materials; 2016; No 2 June

References

Ijaduola (2004), Physica C, 403. ; Girard (2006), Phys Conf Ser, 43, 341, doi.org/10.1088/1742-6596/43/1/085 ; Je (1997), Appl Phys, 49, 6126, doi.org/10.1063/1.364394 ; Musa (1998), Energy Mater Sol Cells, 51, 305, doi.org/10.1016/S0927-0248(97)00233-X ; Kim (2009), Vacuum, 83. ; Kuhaili (2008), Vacuum, 82, 623, doi.org/10.1016/j.vacuum.2007.10.004 ; Díaz (2001), Sci Technol, 14, 576. ; Paranthaman (2004), MRS Bull, 18, 533, doi.org/10.1557/mrs2004.159 ; Ju (2011), of Surface, Journal Analysis, 17, 287. ; Piñol (2000), Sci Technol, 14, 11. ; Gao (1999), Rev Mater Sci, 53, 173, doi.org/10.1146/annurev.matsci.29.1.173 ; Morgiel (2014), Coat Technol, 259. ; Cantoni (2005), IEEE Trans Appl Supercond, 15, 2981, doi.org/10.1109/TASC.2005.848691 ; Kang (2006), Science, 15, 311. ; Vogt (1998), Sci, 49, 399. ; Mašek (2007), Vacuum, 82, 274, doi.org/10.1016/j.vacuum.2007.07.029 ; Cantoni (2004), Sci Technol, 17, 341. ; Kim (2006), Sci Technol, 19, 23. ; Aytug (2004), Phys Lett, 35, 2887. ; Keil (2007), Conf Proc, 882. ; Varanasi (2006), Sci Technol, 19, 896. ; Fujimoto (2013), Phys Conf Ser, 52, 433. ; Narayan (2013), Acta Mater, 61, 2703, doi.org/10.1016/j.actamat.2012.09.070 ; Norton (1990), Phys Lett, 14, 1164. ; Wu (2001), Physica C, 363. ; Zhou (2004), Sci Technol, 18, 107. ; Devlin (2009), Appl Phys, 51, 123534, doi.org/10.1063/1.3152799 ; Wu (2013), Growth Des, 13, 5018, doi.org/10.1021/cg4011983 ; Wang (2003), Phys Lett, 83, 3072. ; Narayan (1992), Phys Lett, 1, 1290. ; Gupta (2003), Appl Phys, 93, 5210, doi.org/10.1063/1.1566472 ; Takahagi (1988), Appl Phys, 64, 3516, doi.org/10.1063/1.341489 ; Lu (2012), Adv, 12, 3008. ; Narayan (2003), Appl Phys, 46, 278, doi.org/10.1063/1.1528301 ; Lim (2008), Thin Solid Films, 516. ; Vispute (1994), Phys Lett, 31, 2565. ; Lanford (1995), Thin Solid Films, 36, 262. ; Soubeyroux (2005), IEEE Trans Appl Supercond, 15, 2687, doi.org/10.1109/TASC.2005.847783 ; Rutter (2004), Sci Technol, 17, 527. ; Aytug (2003), Phys Lett, 83, 3963. ; Chen (2011), ACS Nano, 30, 1321, doi.org/10.1021/nn103028d ; Norton (1996), Science, 13, 274. ; Vispute (1996), Electron Mater, 25, 1740, doi.org/10.1007/s11664-996-0029-9 ; Cantoni (2003), Mater Res, 18, 2387, doi.org/10.1557/JMR.2003.0334 ; Goldacker (2014), Sci Technol, 16, 093001. ; Mattevi (2011), Mater Chem, 21, 3324, doi.org/10.1039/C0JM02126A ; Kusinski (2012), Tech, 60, 711. ; Oh (1993), Appl Phys, 48, 1692, doi.org/10.1063/1.355297 ; Mech (2011), Metall Mater, 56, 903. ; Olowolafe (1992), Appl Phys, 72, 4099, doi.org/10.1063/1.352242 ; Rupich (2003), IEEE Trans Supercond, 17, 2458, doi.org/10.1109/TASC.2003.811820 ; Satta (2003), Electrochem Soc, 150, 300, doi.org/10.1149/1.1564108 ; Varanasi (2005), Sci Technol, 19, 85.
×