Title

Examinations of Selected Thermal Properties of Packages of SiC Schottky Diodes

Journal title

Metrology and Measurement Systems

Yearbook

2016

Volume

vol. 23

Issue

No 3

Authors

Bisewski, Damian ; Myśliwiec, Marcin ; Górecki, Krzysztof ; Kisiel, Ryszard ; Zarębski, Janusz

Keywords

Schottky diodes ; transient thermal impedance ; thermal measurements ; Silicon carbide ; packaging

Divisions of PAS

Nauki Techniczne

Coverage

451-459

Publisher

Polish Academy of Sciences Committee on Metrology and Scientific Instrumentation

Date

2016.09.30

Type

Artykuły / Articles

Identifier

DOI: 10.1515/mms-2016-0033 ; ISSN 2080-9050, e-ISSN 2300-1941

Source

Metrology and Measurement Systems; 2016; vol. 23; No 3; 451-459

References

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