Tytuł artykułu

Examinations of Selected Thermal Properties of Packages of SiC Schottky Diodes

Tytuł czasopisma

Metrology and Measurement Systems




vol. 23


No 3


Słowa kluczowe

Schottky diodes ; transient thermal impedance ; thermal measurements ; Silicon carbide ; packaging

Wydział PAN

Nauki Techniczne




Polish Academy of Sciences Committee on Metrology and Scientific Instrumentation




Artykuły / Articles


DOI: 10.1515/mms-2016-0033 ; ISSN 0860-8229


Metrology and Measurement Systems; 2016; vol. 23; No 3; 451-459


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