Details

Title

Numerical study of heat transfer and aerodynamic drag of the radiator with lamellar split finning

Journal title

Archives of Thermodynamics

Yearbook

2020

Volume

vol. 41

Issue

No 1

Authors

Keywords

Microelectronic device ; Radiator ; Lamellar-split finning ; heat transfer ; Aerodynamic resistance ; numerical simulation

Divisions of PAS

Nauki Techniczne

Coverage

67-93

Publisher

The Committee of Thermodynamics and Combustion of the Polish Academy of Sciences and The Institute of Fluid-Flow Machinery Polish Academy of Sciences

Date

2020.03.27

Type

Article

Identifier

DOI: 10.24425/ather.2020.132950

Source

Archives of Thermodynamics; 2020; vol. 41; No 1; 67-93

Editorial Board

International Advisory Board

J. Bataille, Ecole Central de Lyon, Ecully, France

A. Bejan, Duke University, Durham, USA

W. Blasiak, Royal Institute of Technology, Stockholm, Sweden

G. P. Celata, ENEA, Rome, Italy

L.M. Cheng, Zhejiang University, Hangzhou, China

M. Colaco, Federal University of Rio de Janeiro, Brazil

J. M. Delhaye, CEA, Grenoble, France

M. Giot, Université Catholique de Louvain, Belgium

K. Hooman, University of Queensland, Australia

D. Jackson, University of Manchester, UK

D.F. Li, Kunming University of Science and Technology, Kunming, China

K. Kuwagi, Okayama University of Science, Japan

J. P. Meyer, University of Pretoria, South Africa

S. Michaelides, Texas Christian University, Fort Worth Texas, USA

M. Moran, Ohio State University, Columbus, USA

W. Muschik, Technische Universität Berlin, Germany

I. Müller, Technische Universität Berlin, Germany

H. Nakayama, Japanese Atomic Energy Agency, Japan

S. Nizetic, University of Split, Croatia

H. Orlande, Federal University of Rio de Janeiro, Brazil

M. Podowski, Rensselaer Polytechnic Institute, Troy, USA

A. Rusanov, Institute for Mechanical Engineering Problems NAS, Kharkiv, Ukraine

M. R. von Spakovsky, Virginia Polytechnic Institute and State University, Blacksburg, USA

A. Vallati, Sapienza University of Rome, Italy

H.R. Yang, Tsinghua University, Beijing, China



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