Details
Title
Selective Cu Electrodeposition on Micrometer Trenches Using Microcontact Printing and AdditivesJournal title
Archives of Metallurgy and MaterialsYearbook
2021Volume
vol. 66Issue
No 3Affiliation
Shim, Jinyong : Hanyang University, Department of Material Science & Chemical Engineering, Ansan, Korea ; Lee, Jinhyun : Hanyang University, Department of Material Science & Chemical Engineering, Ansan, Korea ; Yoo, Bongyoung : Hanyang University, Department of Material Science & Chemical Engineering, Ansan, KoreaAuthors
Keywords
µCP ; selective Cu deposition ; RDL ; overburden ; SAM (alkanethiol) ; AdditivesDivisions of PAS
Nauki TechniczneCoverage
741-744Publisher
Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of SciencesBibliography
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