Details
Title
Sn-Pd-Ni Electroplating on Bi2Te3-Based Thermoelectric Elements for Direct Thermocompression Bonding and Creation of a Reliable Bonding InterfaceJournal title
Archives of Metallurgy and MaterialsYearbook
2021Volume
vol. 66Issue
No 4Affiliation
Kang, Seok Jun : Kyungpook National University, Department of Materials Science and Metallurgical Engineering, Daegu, Republic of Korea ; Bae, Sung Hwa : Kyushu University, Graduate School of Engineering, Department of Materials Process Engineering, Fukuoka, Japan ; Son, Injoon : Kyungpook National University, Department of Materials Science and Metallurgical Engineering, Daegu, Republic of KoreaAuthors
Keywords
Tin Electroplating ; Thermoelectric Module ; Thermocompression Bonding ; Bi2Te3 ; Direct BondingDivisions of PAS
Nauki TechniczneCoverage
963-966Publisher
Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of SciencesBibliography
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