Szczegóły

Tytuł artykułu

Effect of the ENEPIG Process on the Bonding Strength of BiTe-based Thermoelectric Elements

Tytuł czasopisma

Archives of Metallurgy and Materials

Rocznik

2021

Wolumin

vol. 66

Numer

No 4

Afiliacje

Kim, Subin : Kyungpook National University, Department of Materials Science and Metallurgical Engineering, Daegu, Republic of Korea ; Bae, Sung Hwa : Kyushu University Graduate School of Engineering, Department of Materials Process Engineering, Fukuoka, Japan ; Son, Injoon : Kyungpook National University, Department of Materials Science and Metallurgical Engineering, Daegu, Republic of Korea

Autorzy

Słowa kluczowe

thermoelectric ; ENEPIG ; bonding strength ; BiTe ; plating

Wydział PAN

Nauki Techniczne

Zakres

967-970

Wydawca

Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Commitee on Metallurgy of Polish Academy of Sciences

Bibliografia

[1] L.D. Hicks, Effect of quantum-well structures on the thermoelectric figure of merit, Phys. Rev. B 47, 12727-12731 (1993).
[2] H.J. Goldsmid, R.W. Douglas, The use of semiconductors in thermoelectric refrigeration, J. Appl. Phys. 5, 386 (1954).
[3] F.J. Isalro, Thermoelectric cooling and power generation, Science 285, 703-706 (1999).
[4] K.T. Kim, S.Y. Choi, E.H. Shin, K.S. Moon, H.Y. Koo, G.G. Lee, G.H. Ha, The influence of CNTs on the thermoelectric properties of a CNT/Bi2Te3 composite, Carbon 52, 541-549 (2013).
[5] F.D. Rosi, Thermoelectricity and thermoelectric power generation, Solid State Electron. 11, 833-868 (1968).
[6] R. Venkatasubramanian, E. Siivola, T. Colpitts, B. O’Quinn, Thinfilm thermoelectric devices with high room-temperature figures of merit, Nature 413, 597-602 (2001).
[7] R.C. Sharma, Y.A. Chang, The Se-Sn (selenium-tin) system, Bull. Alloy Phase Diagr. 7, 68-72 (1986).
[8] C. Chiu, C. Wang, S. Chen, Interfacial reactions in the Sn-Bi/Te couples. J. Electron. Mater. 37, 40-44 (2008).
[9] L. Lo, A. Wu, Interfacial reactions between diffusion barriers and thermoelectric materials under current stressing, J. Electron. Mater. 41, 3325-3330 (2012).
[10] I . Kato, T. Kato, H. Terashima, H. Watanabe, H. Honma, Influences of electroless nickel film conditions on electroless Au/ Pd/Ni wire bondability, Trans. JIEP. 3, 78-85 (2010).
[11] S.H. Bae, J.Y. Choi, I. Son, Effect of electroless Ni-P plating on the bonding strength of PbTe thermoelectric module using silver alloy-based brazing, Mater. Sci. Forum 985, 16-22 (2020).
[12] S. Bae, S. Kim, S. Yi, I. Son, K. Kim, H. Chung, Effect of surface roughness and electroless Ni-P plating on the bonding strength of Bi-Te-based thermoelectric modules, Coatings 9, 213-221 (2019).
[13] Y.T. Choi, S.H. Bae, I. Son, H.S. Sohn, K.T. Kim, Y.W. Ju, fabrication of aluminum-based thermal radiation plate for thermoelectric module using aluminum anodic oxidization and copper electroplating, J Nanosci. Nanotechnol. 18, 6404-6409 (2018).
[14] J . Yoon, S.H. Bae, H.S. Sohn, I. Son, K. Park, S. Cho, K.T. Kim, Fabrication of a Bi2Te3-based thermoelectric module using tin electroplating and thermocompression bonding, J Nanosci. Nanotechnol. 19, 1738-1742 (2019).
[15] K.H. Kim, I. Seo, S,H. W. Kwon, J. K. Kim, J.W. Yoon, S. Yoo, Effects of Ni-P bath on the brittle fracture of Sn-Ag-Cu solder/ ENEPIG solder joint, J. Welding and Joining. 35, 97-202 (2017).
[16] J .H. Back, S. Yoo, D.G. Han, S.B. Jung, J.W. Yoon, Effect of thin ENEPIG plating thickness on interfacial reaction and brittle fracture rate of Sn-0.3Ag-0.5Cu solder joints, Weld. Join. 36, 52-60 (2018).

Data

2021.12.28

Typ

Article

Identyfikator

DOI: 10.24425/amm.2021.136407 ; ISSN 1733-3490

Źródło

Archives of Metallurgy and Materials
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