Tytuł artykułu

Effect of the ENEPIG Process on the Bonding Strength of BiTe-based Thermoelectric Elements

Tytuł czasopisma

Archives of Metallurgy and Materials




vol. 66


No 4


Kim, Subin : Kyungpook National University, Department of Materials Science and Metallurgical Engineering, Daegu, Republic of Korea ; Bae, Sung Hwa : Kyushu University Graduate School of Engineering, Department of Materials Process Engineering, Fukuoka, Japan ; Son, Injoon : Kyungpook National University, Department of Materials Science and Metallurgical Engineering, Daegu, Republic of Korea


Słowa kluczowe

thermoelectric ; ENEPIG ; bonding strength ; BiTe ; plating

Wydział PAN

Nauki Techniczne




Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Commitee on Metallurgy of Polish Academy of Sciences


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DOI: 10.24425/amm.2021.136407 ; ISSN 1733-3490


Archives of Metallurgy and Materials