Details
Title
The performance analysis of dusty photovoltaic panelJournal title
Archives of ThermodynamicsYearbook
2023Volume
vol. 44Issue
No 2Authors
Affiliation
Katoch, Minakshi : K.R. Mangalam University, Gurugram – 122103, India ; Dahiya, Vineet : K.R. Mangalam University, Gurugram – 122103, India ; Yadav, Surendra Kumar : K.R. Mangalam University, Gurugram – 122103, IndiaKeywords
Dust accumulation ; Tilt angle ; Photovoltaics ; solar panel ; TransmittanceDivisions of PAS
Nauki TechniczneCoverage
49-68Publisher
The Committee of Thermodynamics and Combustion of the Polish Academy of Sciences and The Institute of Fluid-Flow Machinery Polish Academy of SciencesDate
2023.08.01Type
ArticleIdentifier
DOI: 10.24425/ather.2023.146558Editorial Board
International Advisory BoardJ. Bataille, Ecole Central de Lyon, Ecully, France
A. Bejan, Duke University, Durham, USA
W. Blasiak, Royal Institute of Technology, Stockholm, Sweden
G. P. Celata, ENEA, Rome, Italy
L.M. Cheng, Zhejiang University, Hangzhou, China
M. Colaco, Federal University of Rio de Janeiro, Brazil
J. M. Delhaye, CEA, Grenoble, France
M. Giot, Université Catholique de Louvain, Belgium
K. Hooman, University of Queensland, Australia
D. Jackson, University of Manchester, UK
D.F. Li, Kunming University of Science and Technology, Kunming, China
K. Kuwagi, Okayama University of Science, Japan
J. P. Meyer, University of Pretoria, South Africa
S. Michaelides, Texas Christian University, Fort Worth Texas, USA
M. Moran, Ohio State University, Columbus, USA
W. Muschik, Technische Universität Berlin, Germany
I. Müller, Technische Universität Berlin, Germany
H. Nakayama, Japanese Atomic Energy Agency, Japan
S. Nizetic, University of Split, Croatia
H. Orlande, Federal University of Rio de Janeiro, Brazil
M. Podowski, Rensselaer Polytechnic Institute, Troy, USA
A. Rusanov, Institute for Mechanical Engineering Problems NAS, Kharkiv, Ukraine
M. R. von Spakovsky, Virginia Polytechnic Institute and State University, Blacksburg, USA
A. Vallati, Sapienza University of Rome, Italy
H.R. Yang, Tsinghua University, Beijing, China