Title

Intermetallic compound layer formation in indium-based micro-bump array fabrication technology for IR detectors

Journal title

Opto-Electronics Review

Yearbook

2024

Volume

32

Issue

1

Affiliation

Kozłowski, Paweł :  Łukasiewicz Research Network – Institute of Microelectronics and Photonics, Al. Lotników 32/46, 02-668 Warsaw, Poland ; Jasik, Agata :  Łukasiewicz Research Network – Institute of Microelectronics and Photonics, Al. Lotników 32/46, 02-668 Warsaw, Poland ; Łaszcz, Adam :  Łukasiewicz Research Network – Institute of Microelectronics and Photonics, Al. Lotników 32/46, 02-668 Warsaw, Poland ; Czuba, Krzysztof :  Łukasiewicz Research Network – Institute of Microelectronics and Photonics, Al. Lotników 32/46, 02-668 Warsaw, Poland ; Chmielewski, Krzysztof :  Łukasiewicz Research Network – Institute of Microelectronics and Photonics, Al. Lotników 32/46, 02-668 Warsaw, Poland ; Zdunek, Krzysztof : Warsaw University of Technology, Faculty of Materials Science and Engineering, ul. Wołoska 141, 02-507 Warsaw, Poland

Authors

Kozłowski, Paweł ; Jasik, Agata ; Łaszcz, Adam ; Czuba, Krzysztof ; Chmielewski, Krzysztof ; Zdunek, Krzysztof

Keywords

indium micro-bump ; under bump metallization ; intermetallic alloy ; focused ion beam ; energy dispersive spectrometry

Divisions of PAS

Nauki Techniczne

Coverage

e148833

Publisher

Polish Academy of Sciences (under the auspices of the Committee on Electronics and Telecommunication) and Association of Polish Electrical Engineers in cooperation with Military University of Technology

Date

15.12.2023

Type

Article

Identifier

DOI: 10.24425/opelre.2024.148833