Title

Effect of variable thermal conductivity in semiconducting medium underlying an elastic half-space

Journal title

Archives of Thermodynamics

Yearbook

2024

Volume

vol. 45

Issue

No 3

Affiliation

Ailawalia, Praveen : Department of Mathematics, University Institute of Sciences, Chandigarh University, Gharuan, Mohali, Punjab, India ; Priyanka : I.G.N College, Ladwa, Haryana, India

Authors

Ailawalia, Praveen ; Priyanka

Keywords

Semiconducting medium ; Thermal conductivity ; Temperature distribution ; Normal mode analysis ; Carrier density

Divisions of PAS

Nauki Techniczne

Coverage

159-166

Publisher

The Committee of Thermodynamics and Combustion of the Polish Academy of Sciences and The Institute of Fluid-Flow Machinery Polish Academy of Sciences

Date

12.07.2024

Type

Article

Identifier

DOI: 10.24425/ather.2024.151226

Editorial Board

International Advisory Board

J. Bataille, Ecole Central de Lyon, Ecully, France

A. Bejan, Duke University, Durham, USA

W. Blasiak, Royal Institute of Technology, Stockholm, Sweden

G. P. Celata, ENEA, Rome, Italy

L.M. Cheng, Zhejiang University, Hangzhou, China

M. Colaco, Federal University of Rio de Janeiro, Brazil

J. M. Delhaye, CEA, Grenoble, France

M. Giot, Université Catholique de Louvain, Belgium

K. Hooman, University of Queensland, Australia

D. Jackson, University of Manchester, UK

D.F. Li, Kunming University of Science and Technology, Kunming, China

K. Kuwagi, Okayama University of Science, Japan

J. P. Meyer, University of Pretoria, South Africa

S. Michaelides, Texas Christian University, Fort Worth Texas, USA

M. Moran, Ohio State University, Columbus, USA

W. Muschik, Technische Universität Berlin, Germany

I. Müller, Technische Universität Berlin, Germany

H. Nakayama, Japanese Atomic Energy Agency, Japan

S. Nizetic, University of Split, Croatia

H. Orlande, Federal University of Rio de Janeiro, Brazil

M. Podowski, Rensselaer Polytechnic Institute, Troy, USA

A. Rusanov, Institute for Mechanical Engineering Problems NAS, Kharkiv, Ukraine

M. R. von Spakovsky, Virginia Polytechnic Institute and State University, Blacksburg, USA

A. Vallati, Sapienza University of Rome, Italy

H.R. Yang, Tsinghua University, Beijing, China