Szczegóły

Tytuł artykułu

Impact of Bismuth as Microalloying Element in Sn-0.7Cu Lead-Free Solder Alloys

Tytuł czasopisma

Archives of Metallurgy and Materials

Rocznik

2025

Wolumin

vol. 70

Numer

No 4

Autorzy

Afiliacje

Zaimi, N.S.M. : Universiti Sains Malaysia, School of Mechanical Engineering, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia ; Salleh, M.A.A.M. : Universiti Malaysia Perlis (UniMAP), Faculty of Chemical Engineering and Technology, Center of Excellence Geopolymer & Green Technology (CeGeoGTech), Taman Muhibbah, 02600 Jejawi, Arau, Perlis, Malaysia ; Baser, M.F.H. : Universiti Malaysia Perlis (UniMAP), Faculty of Chemical Engineering and Technology, Center of Excellence Geopolymer & Green Technology (CeGeoGTech), Taman Muhibbah, 02600 Jejawi, Arau, Perlis, Malaysia ; Baharin, N.A.I. : Universiti Malaysia Perlis (UniMAP), Faculty of Chemical Engineering and Technology, Center of Excellence Geopolymer & Green Technology (CeGeoGTech), Taman Muhibbah, 02600 Jejawi, Arau, Perlis, Malaysia ; Aziz, M.S.A. : Universiti Sains Malaysia, School of Mechanical Engineering, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia ; Abdullah, M.M. Al B. : Universiti Malaysia Perlis (UniMAP), Faculty of Chemical Engineering and Technology, Center of Excellence Geopolymer & Green Technology (CeGeoGTech), Taman Muhibbah, 02600 Jejawi, Arau, Perlis, Malaysia ; Nabiałek, M. : Czestochowa University of Technology, Faculty of Production Engineering and Materials Technology, Department of Physics, 19 Armii Krajowej Av., 42-200 Częstochowa, Poland

Słowa kluczowe

Lead-free solder ; Bismuth ; Intermetallic ; Microstructure ; Shear

Wydział PAN

Nauki Techniczne

Zakres

1753-1758

Wydawca

Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences

Data

22.12.2025

Typ

Article

Identyfikator

DOI: 10.24425/amm.2025.156258 ; e-ISSN 2300-1909
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