Title

Effect of Cu-Cu Hybrid Bonding Height in the 3D Stacked Die Configuration: Thermal-Structural Analysis

Journal title

Archives of Metallurgy and Materials

Yearbook

2025

Volume

vol. 70

Issue

No 4

Authors

Che Halin, D.S. ; Abdul Aziz, Mohd Sharizal ; Khor, C. Y. ; Goh, Z. L. ; Stambuła, S. ; Nabiałek, M.

Affiliation

Abdul Aziz, Mohd Sharizal : Universiti Sains Malaysia, School of Mechanical Engineering, Nibong Tebal, Penang, Malaysia ; Khor, C. Y. : Universiti Malaysia Perlis (UniMAP), Faculty of Mechanical Engineering and Technology, Arau, Perlis, Malaysia ; Goh, Z. L. : Universiti Sains Malaysia, School of Mechanical Engineering, Nibong Tebal, Penang, Malaysia ; Che Halin, D. S. : Universiti Malaysia Perlis (UniMAP), Faculty of Chemical Engineering and Technology; Centre of Excellence Geopolymer and Green Technology (CEGeoGTech), Arau, Perlis, Malaysia ; Che Halin, D. S. : Universiti Malaysia Perlis (Unimap), Centre of Excellent Geopolymer and Green Technology (Cegeogtech), Kompleks Pusat Pengajian Jejawi 2, Taman Muhibbah, 02600, Arau, Perlis, Malaysia ; Stambuła, S. : Czestochowa University of Technology, Faculty of Production Engineering and Materials Technology, Department of Physics, Częstochowa, Poland ; Nabiałek, M. : Czestochowa University of Technology, Faculty of Production Engineering and Materials Technology, Department of Physics, Częstochowa, Poland

Keywords

Hybrid bonding ; Thermal-Structural Coupling ; Warpage ; 3D stacked die ; Thermal cycles

Divisions of PAS

Nauki Techniczne

Coverage

1785-1790

Publisher

Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences

Date

22.12.2025

Type

Article

Identifier

DOI: 10.24425/amm.2025.156262