Szczegóły Szczegóły PDF BIBTEX RIS Tytuł artykułu Cu Electrodeposition on Polypyrrole Precoat for the Metallization of Printed Circuit Boards Tytuł czasopisma Archives of Metallurgy and Materials Rocznik 2025 Wolumin vol. 70 Numer No 4 Autorzy Junhui, Hu ; Hui, Y. ; Xiaoge, Ch. ; Chuanyun, W. Afiliacje Junhui, Hu : Shanghai Institute of Technology, School of Chemical and Environmental Engineering, Shanghai, China ; Hui, Y. : Shanghai Institute of Technology, School of Chemical and Environmental Engineering, Shanghai, China ; Xiaoge, Ch. : Shanghai Institute of Technology, School of Chemical and Environmental Engineering, Shanghai, China ; Chuanyun, W. : Shanghai Institute of Technology, School of Chemical and Environmental Engineering, Shanghai, China Słowa kluczowe Polypyrrole precoat ; Plastic metallization ; Printed circuit board Wydział PAN Nauki Techniczne Zakres 1905-1912 Wydawca Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences Data 22.12.2025 Typ Article Identyfikator DOI: 10.24425/amm.2025.156277 ; e-ISSN 2300-1909 <div class="test"></div>