Szczegóły Szczegóły PDF BIBTEX RIS Tytuł artykułu Heat dissipation and temperature distribution in long interconnect lines Tytuł czasopisma Bulletin of the Polish Academy of Sciences Technical Sciences Rocznik 2010 Wolumin 58 Numer No 1 Autorzy Gnidzinska, K. ; De Mey, G. ; Napieralski, A. Wydział PAN Nauki Techniczne Zakres 119-124 Data 2010 Identyfikator DOI: 10.2478/v10175-010-0012-8 ; ISSN 2300-1917 Źródło Bulletin of the Polish Academy of Sciences: Technical Sciences; 2010; 58; No 1; 119-124 Referencje <i>International Technology Roadmap for Semiconductors</i> <a target="_blank" href='http://www.itrs.net/'>http://www.itrs.net/</a> ; Chatzigeorgiou A. (2001), Modeling CMOS gates driving RC interconnect loads, IEEE Trans. Circuits and Systems II: Analog and Digital Signal Processing, 48, 4, 413. ; Ismail Y. (1999), Dynamic and short-circuit power of CMOS gates driving lossless transmission lines, IEEE Trans. Circuits and Systems I: Analog and Digital Signal Processing, 46, 8, 950. ; <i>Predictive Technology Model (PTM)</i> <a target="_blank" href='http://ptm.asu.edu/'>http://ptm.asu.edu/</a> ; Vermeersch B. (2006), Thermal impedance plots of micro-scaled devices, Microelectronics and Reliability, 46, 1, 174. ; G. De Mey (2002), Various Applications of the Boundary Element Method. ; Çengel Y. (2002), Heat Transfer: a Practical Approach. ; Chiang T.-Y. (2002), Analytical thermal model for multilevel VLSI interconnects incorporating via effect, IEEE Electron Device Letters, 23, 1, 31.