Title

The Influence of Soldering Conditions on Conductivity, Structure and Strength of Cu/Sn96Ag4 Solders

Journal title

Archives of Metallurgy and Materials

Yearbook

2012

Issue

No 1 March

Authors

Perek-Nowak, M. ; Boczkal, G. ; Marecki, P.

Divisions of PAS

Nauki Techniczne

Publisher

Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences

Date

2012

Identifier

DOI: 10.2478/v10172-011-0149-y ; e-ISSN 2300-1909

Source

Archives of Metallurgy and Materials; 2012; No 1 March

References

ISO/CD 857-2 Welding and allied processes - Vocabulary - Part 2 Soldering and brazing processes and related terms. ; Bradley E. (2007), Lead-Free Electronics, doi.org/10.1002/9780470171479 ; Abtew M. (2000), Materials Science and Engineering, 27, 95, doi.org/10.1016/S0927-796X(00)00010-3 ; Winiowski A. (2006), Archives of Metallurgy and Materials, 51, 399. ; Choi S. (2000), Journal of Materials Science: Materials In Electronics, 11, 497, doi.org/10.1023/A:1008968518512 ; Jae Park (2000), Journal of Electronic Materials, 29, 10, doi.org/10.1007/s11664-000-0086-4 ; Kang S. (2002), Journal of Electronic Materials, 31. ; Shih-Kang Lin (2008), Journal of Electronic Materials, 37. ; Hwa-Teng Lee (2009), Journal of Electronic Materials, 38, 10. ; Hirose A. (2004), Journal of Technology of Advanced Materials, 5, 267, doi.org/10.1016/j.stam.2003.10.024 ; Nowacki J. (2007), Lutowanie w budowie maszyn.