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Abstract

The article introduces a method for selecting the best clamping conditions to obtain vibration reduction during the milling of large-size workpieces. It is based on experimental modal analysis performed for a set of assumed, fixing conditions of a considered workpiece to identify frequency response functions (FRFs) for each tightening torque of the mounting screws. Simulated plots of periodically changing nominal cutting forces are then calculated. Subsequently, by multiplying FRF and spectra of cutting forces, a clamping selection function (CSF) is determined, and, thanks to this function, vibration root mean square (RMS) is calculated resulting in the clamping selection indicator (CSI) that indicates the best clamping of the workpiece. The effectiveness of the method was evidenced by assessing the RMS value of the vibration level observed in the time domain during the real-time face milling process of a large-sized exemplary item. The proposed approach may be useful for seeking the best conditions for fixing the workpiece on the table.
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Authors and Affiliations

Krzysztof J. Kaliński
1
ORCID: ORCID
Marek A. Galewski
1
ORCID: ORCID
Natalia Stawicka-Morawska
1
ORCID: ORCID
Krzysztof Jemielniak
2
ORCID: ORCID
Michał R. Mazur
1
ORCID: ORCID

  1. Gdansk University of Technology, Faculty of Mechanical Engineering and Ship Technology, Institute of Mechanics and Machine Design,Gdansk, 80-233, Poland
  2. Warsaw University of Technology, Faculty of Mechanical and Industrial Engineering, Institute of Manufacturing Processes,Warsaw, 00-661, Poland
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Abstract

This work reports on the investigation of homogeneity of the inside of indium micro-bumps/ columns placed on Ti/Pt/Au under bump metallisation. This is very important for connection resistivity, long-time durability, and subsequent hybridisation process (e.g., die-bonding). Gold reacts with indium to form intermetallic alloys with different chemo-physical parameters than pure indium. The geometrical and structural parameters of intermetallic alloys were analysed based on transmission electron microscope images. Distribution of elements in the investigated samples was determined using the transmission electron micro-scope with energy dispersive spectroscopy method. A thickness of intermetallic alloy was 1.02 μm and 1.67 μm in non-annealed (A) and annealed (B) indium columns, respectively. The layered and column-like interior structure of alloys was observed for both samples, respectively, with twice bigger grains in sample B. The graded chemical composition of Au-In intermetallic alloy was detected for the non-annealed In columns in contrast to the constant composition of 40% of Au and 60% of In for the annealed sample B. The atomic distribution has a minor impact on the In column mechanical stability. A yield above 99% of an In column with a 25 µm diameter and a 11 µm height is possible for a uniform columnar structure of intermetallic alloy with a thickness of 1.67 μm.
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Authors and Affiliations

Paweł Kozłowski
1
ORCID: ORCID
Agata Jasik
1
ORCID: ORCID
Adam Łaszcz
1
ORCID: ORCID
Krzysztof Czuba
1
ORCID: ORCID
Krzysztof Chmielewski
1
ORCID: ORCID
Krzysztof Zdunek
2
ORCID: ORCID

  1.  Łukasiewicz Research Network – Institute of Microelectronics and Photonics, Al. Lotników 32/46, 02-668 Warsaw, Poland
  2. Warsaw University of Technology, Faculty of Materials Science and Engineering, ul. Wołoska 141, 02-507 Warsaw, Poland

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