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[References = "Bradley E. \(2007\), Lead\-Free Electronics, doi.org\/10.1002\/9780470171479"]
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Archives of Metallurgy and Materials (1)
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The Influence of Soldering Conditions on Conductivity, Structure and Strength of Cu/Sn96Ag4 Solders
M. Perek-Nowak
G. Boczkal
P. Marecki
Archives of Metallurgy and Materials | 2012 | No 1 March
| DOI:
10.2478/v10172-011-0149-y
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Authors and Affiliations
Authors and Affiliations
M. Perek-Nowak
G. Boczkal
P. Marecki
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