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[References = "Gierlotka \(2007\), Mater Res, 22, 3158."]
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Archives of Metallurgy and Materials (1)
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Transient Liquid Phase Behavior of Sn-Coated Cu Particles and Chip Bonding using Paste Containing the Particles
Jun Ho Hwang
Jong-Hyun Lee
Archives of Metallurgy and Materials | 2017 | vol. 62 | No 2
| DOI:
10.1515/amm-2017-0167
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Authors and Affiliations
Authors and Affiliations
Jun Ho Hwang
Jong-Hyun Lee
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