Title

Influence of Temperature on Flexible Printed Circuit Board During Reflow Soldering

Journal title

Archives of Metallurgy and Materials

Yearbook

2025

Volume

vol. 70

Issue

No 4

Authors

Abdul Aziz, M.S. ; Khor, C.Y. ; Sabri, M.R.M. ; Kamarudin, R. ; Rahiman, W. ; Che Halin, D.S. ; Pietrusiewicz, P.

Affiliation

Abdul Aziz, M.S. : Universiti Sains Malaysia, School of Mechanical Engineering, 14300 Nibong Tebal, Seberang Perai Selatan, Penang, Malaysia ; Khor, C.Y. : Universiti Malaysia Perlis (Unimap), Faculty of Mechanical Engineering & Technology, 02600 Arau, Perlis, Malaysia ; Sabri, M.R.M. : Universiti Sains Malaysia, School of Mechanical Engineering, 14300 Nibong Tebal, Seberang Perai Selatan, Penang, Malaysia ; Kamarudin, R. : Universiti Sains Malaysia, School of Mechanical Engineering, 14300 Nibong Tebal, Seberang Perai Selatan, Penang, Malaysia ; Rahiman, W. : Universiti Sains Malaysia, School of Electrical And Electronic Engineering, 14300 Nibong Tebal, Seberang Perai Selatan, Penang, Malaysia ; Che Halin, D.S. : Universiti Malaysia Perlis (Unimap), Faculty of Chemical Engineering & Technology Kompleks Pusat Pengajian Jejawi 2, Taman Muhibbah, 02600, Arau, Perlis, Malaysia ; Che Halin, D.S. : Universiti Malaysia Perlis (Unimap), Centre of Excellent Geopolymer and Green Technology (Cegeogtech), Kompleks Pusat Pengajian Jejawi 2, Taman Muhibbah, 02600, Arau, Perlis, Malaysia ; Pietrusiewicz, P. : Czestochowa University of Technology, Faculty of Production Engineering and Materials Technology, Department of Physics, 19 Armii Krajowej Av., 42-200 Częstochowa, Poland

Keywords

Flexible Printed Circuit Boards ; Rigid Printed Circuit Boards ; Temperature profile ; reflow soldering ; deformation

Divisions of PAS

Nauki Techniczne

Coverage

1777-1783

Publisher

Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences

Date

22.12.2025

Type

Article

Identifier

DOI: 10.24425/amm.2025.156261