Tytuł artykułu

Influence of Temperature on Flexible Printed Circuit Board During Reflow Soldering

Tytuł czasopisma

Archives of Metallurgy and Materials

Rocznik

2025

Wolumin

vol. 70

Numer

No 4

Autorzy

Abdul Aziz, M.S. ; Khor, C.Y. ; Sabri, M.R.M. ; Kamarudin, R. ; Rahiman, W. ; Che Halin, D.S. ; Pietrusiewicz, P.

Afiliacje

Abdul Aziz, M.S. : Universiti Sains Malaysia, School of Mechanical Engineering, 14300 Nibong Tebal, Seberang Perai Selatan, Penang, Malaysia ; Khor, C.Y. : Universiti Malaysia Perlis (Unimap), Faculty of Mechanical Engineering & Technology, 02600 Arau, Perlis, Malaysia ; Sabri, M.R.M. : Universiti Sains Malaysia, School of Mechanical Engineering, 14300 Nibong Tebal, Seberang Perai Selatan, Penang, Malaysia ; Kamarudin, R. : Universiti Sains Malaysia, School of Mechanical Engineering, 14300 Nibong Tebal, Seberang Perai Selatan, Penang, Malaysia ; Rahiman, W. : Universiti Sains Malaysia, School of Electrical And Electronic Engineering, 14300 Nibong Tebal, Seberang Perai Selatan, Penang, Malaysia ; Che Halin, D.S. : Universiti Malaysia Perlis (Unimap), Faculty of Chemical Engineering & Technology Kompleks Pusat Pengajian Jejawi 2, Taman Muhibbah, 02600, Arau, Perlis, Malaysia ; Che Halin, D.S. : Universiti Malaysia Perlis (Unimap), Centre of Excellent Geopolymer and Green Technology (Cegeogtech), Kompleks Pusat Pengajian Jejawi 2, Taman Muhibbah, 02600, Arau, Perlis, Malaysia ; Pietrusiewicz, P. : Czestochowa University of Technology, Faculty of Production Engineering and Materials Technology, Department of Physics, 19 Armii Krajowej Av., 42-200 Częstochowa, Poland

Słowa kluczowe

Flexible Printed Circuit Boards ; Rigid Printed Circuit Boards ; Temperature profile ; reflow soldering ; deformation

Wydział PAN

Nauki Techniczne

Zakres

1777-1783

Wydawca

Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences

Data

22.12.2025

Typ

Article

Identyfikator

DOI: 10.24425/amm.2025.156261 ; e-ISSN 2300-1909