Details

Title

An Innovative Device for Measuring Thermal Conductivity of Solids Utilising Transient Measurement Methods

Journal title

Archives of Thermodynamics

Yearbook

2026

Volume

vol. 47

Issue

No 1

Authors

Affiliation

Karthika, M. S. : Department of Mechanical Engineering, JSS Science and Technology University, Mysuru 570 006, Karnataka, India ; Aruna, Mangalpady : Department of Mining Engineering, National Institute of Technology, Karnataka, Surathkal, Mangalore 575 025, Karnataka, India ; Reddy, P. Siva Kota : Department of Mathematics, JSS Science and Technology University, Mysuru 570 006, Karnataka, India ; Reddy, P. Siva Kota : Universidad Bernardo O'Higgins, Facultad de Ingeniería, Ciencia y Tecnología, Departamento de Formación y Desarrollo Científico en Ingeniería, Av. Viel 1497, Santiago, Chile

Keywords

Thermal conductivity ; Sensor assembly ; Electronic bridge circuit ; Transient technique ; Solids

Divisions of PAS

Nauki Techniczne

Coverage

213‒226

Publisher

The Committee of Thermodynamics and Combustion of the Polish Academy of Sciences and The Institute of Fluid-Flow Machinery Polish Academy of Sciences

Date

23.04.2026

Type

Article

Identifier

DOI: 10.24425/ather.2026.158671

Editorial Board

International Advisory Board

J. Bataille, Ecole Central de Lyon, Ecully, France

A. Bejan, Duke University, Durham, USA

A. C. Benim, Duesseldorf University of Applied Sciences, Germany

W. Blasiak, Royal Institute of Technology, Stockholm, Sweden

G. P. Celata, ENEA, Rome, Italy

L.M. Cheng, Zhejiang University, Hangzhou, China

M. Colaco, Federal University of Rio de Janeiro, Brazil

J. M. Delhaye, CEA, Grenoble, France

M. Giot, Université Catholique de Louvain, Belgium

K. Hooman, University of Queensland, Australia

D. Jackson, University of Manchester, UK

D.F. Li, Kunming University of Science and Technology, Kunming, China

K. Kuwagi, Okayama University of Science, Japan

J. P. Meyer, University of Pretoria, South Africa

S. Michaelides, Texas Christian University, Fort Worth Texas, USA

M. Moran, Ohio State University, Columbus, USA

W. Muschik, Technische Universität Berlin, Germany

I. Müller, Technische Universität Berlin, Germany

H. Nakayama, Japanese Atomic Energy Agency, Japan

S. Nizetic, University of Split, Croatia

H. Orlande, Federal University of Rio de Janeiro, Brazil

M. Podowski, Rensselaer Polytechnic Institute, Troy, USA

A. Rusanov, Institute for Mechanical Engineering Problems NAS, Kharkiv, Ukraine

M. R. von Spakovsky, Virginia Polytechnic Institute and State University, Blacksburg, USA

A. Vallati, Sapienza University of Rome, Italy

H.R. Yang, Tsinghua University, Beijing, China




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