Szczegóły
Tytuł artykułu
An Innovative Device for Measuring Thermal Conductivity of Solids Utilising Transient Measurement MethodsTytuł czasopisma
Archives of ThermodynamicsRocznik
2026Wolumin
vol. 47Numer
No 1Autorzy
Afiliacje
Karthika, M. S. : Department of Mechanical Engineering, JSS Science and Technology University, Mysuru 570 006, Karnataka, India ; Aruna, Mangalpady : Department of Mining Engineering, National Institute of Technology, Karnataka, Surathkal, Mangalore 575 025, Karnataka, India ; Reddy, P. Siva Kota : Department of Mathematics, JSS Science and Technology University, Mysuru 570 006, Karnataka, India ; Reddy, P. Siva Kota : Universidad Bernardo O'Higgins, Facultad de Ingeniería, Ciencia y Tecnología, Departamento de Formación y Desarrollo Científico en Ingeniería, Av. Viel 1497, Santiago, ChileSłowa kluczowe
Thermal conductivity ; Sensor assembly ; Electronic bridge circuit ; Transient technique ; SolidsWydział PAN
Nauki TechniczneZakres
213‒226Wydawca
The Committee of Thermodynamics and Combustion of the Polish Academy of Sciences and The Institute of Fluid-Flow Machinery Polish Academy of SciencesData
23.04.2026Typ
ArticleIdentyfikator
DOI: 10.24425/ather.2026.158671 ; ISSN 1231-0956 ; eISSN 2083-6023Rada naukowa
International Advisory BoardJ. Bataille, Ecole Central de Lyon, Ecully, France
A. Bejan, Duke University, Durham, USA
A. C. Benim, Duesseldorf University of Applied Sciences, Germany
W. Blasiak, Royal Institute of Technology, Stockholm, Sweden
G. P. Celata, ENEA, Rome, Italy
L.M. Cheng, Zhejiang University, Hangzhou, China
M. Colaco, Federal University of Rio de Janeiro, Brazil
J. M. Delhaye, CEA, Grenoble, France
M. Giot, Université Catholique de Louvain, Belgium
K. Hooman, University of Queensland, Australia
D. Jackson, University of Manchester, UK
D.F. Li, Kunming University of Science and Technology, Kunming, China
K. Kuwagi, Okayama University of Science, Japan
J. P. Meyer, University of Pretoria, South Africa
S. Michaelides, Texas Christian University, Fort Worth Texas, USA
M. Moran, Ohio State University, Columbus, USA
W. Muschik, Technische Universität Berlin, Germany
I. Müller, Technische Universität Berlin, Germany
H. Nakayama, Japanese Atomic Energy Agency, Japan
S. Nizetic, University of Split, Croatia
H. Orlande, Federal University of Rio de Janeiro, Brazil
M. Podowski, Rensselaer Polytechnic Institute, Troy, USA
A. Rusanov, Institute for Mechanical Engineering Problems NAS, Kharkiv, Ukraine
M. R. von Spakovsky, Virginia Polytechnic Institute and State University, Blacksburg, USA
A. Vallati, Sapienza University of Rome, Italy
H.R. Yang, Tsinghua University, Beijing, China