Title

Mixed convection heat transfer in trapezoidal lid-driven cavity with uniformly heated inner circular cylinder

Journal title

Archives of Thermodynamics

Yearbook

2023

Volume

vol. 44

Issue

No 3

Affiliation

Hussein, Asmaa Ali : Middle Technical University, Institute of Technology/Baghdad, Baghdad, Iraq

Authors

Hussein, Asmaa Ali

Keywords

Cavity ; Heat transfer ; mixed convection ; Lid-driven

Divisions of PAS

Nauki Techniczne

Coverage

99-118

Publisher

The Committee of Thermodynamics and Combustion of the Polish Academy of Sciences and The Institute of Fluid-Flow Machinery Polish Academy of Sciences

Date

2023.12.04

Type

Article

Identifier

DOI: 10.24425/ather.2023.147539

Editorial Board

International Advisory Board

J. Bataille, Ecole Central de Lyon, Ecully, France

A. Bejan, Duke University, Durham, USA

W. Blasiak, Royal Institute of Technology, Stockholm, Sweden

G. P. Celata, ENEA, Rome, Italy

L.M. Cheng, Zhejiang University, Hangzhou, China

M. Colaco, Federal University of Rio de Janeiro, Brazil

J. M. Delhaye, CEA, Grenoble, France

M. Giot, Université Catholique de Louvain, Belgium

K. Hooman, University of Queensland, Australia

D. Jackson, University of Manchester, UK

D.F. Li, Kunming University of Science and Technology, Kunming, China

K. Kuwagi, Okayama University of Science, Japan

J. P. Meyer, University of Pretoria, South Africa

S. Michaelides, Texas Christian University, Fort Worth Texas, USA

M. Moran, Ohio State University, Columbus, USA

W. Muschik, Technische Universität Berlin, Germany

I. Müller, Technische Universität Berlin, Germany

H. Nakayama, Japanese Atomic Energy Agency, Japan

S. Nizetic, University of Split, Croatia

H. Orlande, Federal University of Rio de Janeiro, Brazil

M. Podowski, Rensselaer Polytechnic Institute, Troy, USA

A. Rusanov, Institute for Mechanical Engineering Problems NAS, Kharkiv, Ukraine

M. R. von Spakovsky, Virginia Polytechnic Institute and State University, Blacksburg, USA

A. Vallati, Sapienza University of Rome, Italy

H.R. Yang, Tsinghua University, Beijing, China