In this study, variations in the contact resistance of electroplated Au-Fe alloy layers with Fe content were investigated. The contact resistance of electroplated Au-Fe alloy layers that were subject to thermal aging at 260°C in the atmosphere, tended to increase significantly with an increase in the Fe content. Through an analysis method employing X-ray photoelectron spectroscopy (XPS/ ESCA) and Auger electron spectroscopy (AES), Ni oxides, such as NiO and Ni2O3, on the surface of the thermally aged electroplated Au-Fe alloy layers were observed. It is believed that the Ni oxide existing on the surface diffused from the underlying electroplated Ni layers to the surface through the grain boundaries in the electroplated Au-Fe layers during the thermal aging. As the Fe content in the electroplated Au-Fe layers increased, the grain size decreased. As the grain size decreases, more Ni oxide was detected on the surface. Therefore, with a rise in the Fe content, more Ni diffuses to the surface via grain boundaries, and more Ni oxide is formed on the surface of the electroplated Au-Fe layers, increasing the contact resistance of the electroplated Au-Fe alloy layers.

In this study, the effect of electroless Pd-P plating on the bonding strength of the Bi-Te thermoelectric elements was investigated. The bonding strength was approximately doubled by electroless Pd-P plating. Brittle Sn-Te intermetallic compounds were formed on the bonding interface of the thermoelectric elements without electroless Pd-P plating, and the fracture of the bond originated from these intermetallic compounds. A Pd-Sn solder reaction layer with a thickness of approximately 20 µm was formed under the Pd-P plating layer in the case of the electroless Pd-P plating, and prevented the diffusion of Bi and Te. In addition, the fracture did not occur on the bonding interface but in the thermoelectric elements for the electroless Pd-P plating because the bonding strength of the Pd-Sn reaction layer was higher than the shear strength of the thermoelectric elements.

Direct energy deposition (DED) is a three-dimensional (3D) deposition technique that uses metallic powder; it is a multi-bead, multi-layered deposition technique. This study investigates the dependence of the defects of the 3D deposition and the process parameters of the DED technique as well as deposition characteristics and the hardness properties of the deposited material. In this study, high-thermal-conductivity steel (HTCS-150) was deposited onto a JIS SKD61 substrate. In single bead deposition experiments, the height and width of the single bead became bigger with increasing the laser power. The powder feeding rate affected only the height, which increased as the powder feeding rate rose. The scanning speed inversely affected the height, unlike the powder feeding rate. The multi-layered deposition was characterized by pores, a lack of fusion, pores formed by evaporated gas, and pores formed by non-molten metal inside the deposited material. The porosity was quantitatively measured in cross-sections of the depositions, revealing that the lack of fusion tended to increase as the laser power decreased; however, the powder feeding rate and overlap width increased. The pores formed by evaporated gas and non-molten metal tended to increase with rising the laser power and powder feeding rate; however, the overlap width decreased. Finally, measurement of the hardness of the deposited material at 25℃, 300℃, and 600℃ revealed that it had a higher hardness than the conventional annealed SKD61.

Trace elements Co, Cr were added to investigate their influence on the microstructure and physical properties of Al-Si extruded alloy. The Co, Cr elements were randomly distributed in the matrix, forms intermetallic phase and their existence were confirmed by XRD, EDS and SEM analysis. With addition of trace elements, the microstructure was modified, Si particle size was reduced and the growth rate of β-(Al5FeSi) phase limited. Compared to parent alloy, hardness and tensile strength were enhanced while the linear coefficient of thermal expansion (CTE) was significantly reduced by 42.4% and 16.05% with Co and Cr addition respectively. It is considered that the low CTE occurs with addition of Co was due to the formation of intermetallic compound having low coefficient of thermal expansion. The results suggested that Co acts as an effective element in improving the mechanical properties of Al-Si alloy.

In this study, the extrusion characteristics of Al-2Zn-1Cu-0.5Mg-0.5RE alloys at 450, 500, and 550℃ were investigated for the high formability of aluminum alloys. The melt was maintained at 720℃ for 20 minutes, then poured into the mold at 200℃ and hot-extruded with a 12 mm thickness bar at a ratio of 38:1. The average grain size was 175.5, 650.1, and 325.9 μm as the extrusion temperature increased to 450, 500 and 550℃, although the change of the phase fraction was not significant as the extrusion temperature increased. Cube texture increased with the increase of extrusion temperature to 450, 500 and 550℃. As the extrusion temperature increased, the electrical conductivity increased by 47.546, 47.592 and 47.725%IACS, and the tensile strength decreased to 92.6, 87.5, 81.4 MPa. Therefore, the extrusion temperature of Al extrusion specimen was investigated to study microstructure and mechanical properties.

In this study, we investigated the effect of Fe addition (0, 0.25, 0.50 and 0.75 wt.%) on the microstructure, mechanical properties and electrical conductivity of as-cast and as-extruded Al-RE alloys. As the Fe element increased by 0 and 0.75wt.%, the phase fraction increased to 5.05, 5.76, 7.14 and 7.38 %. The increased intermetallic compound increased the driving force for recrystallization and grain refinement. The electrical conductivity of Al-1.0 wt.%RE alloy with Fe addition decreased to 60.29, 60.15, 59.58 and 59.13 %IACS. With an increase in the Fe content from 0 to 0.75 wt.% the ultimate tensile strength (UTS) of the alloy increased from 74.3 to 77.5 MPa. As the mechanical properties increase compared to the reduction of the electrical conductivity due to Fe element addition, it is considered to be suitable for fields requiring high electrical conductivity and strength.

This research describes effects of Si addition on microstructure and mechanical properties of the Al-Cr based alloys prepared manufactured using gas atomization and SPS (Spark Plasma Sintering) processes. The Al-Cr-Si bulks with high Cr and Si content were produced successfully using SPS sintering process without crack and obtained fully dense specimens close to nearly 100% T. D. (Theoretical Density). Microstructure of the as-atomized Al-Cr-Si alloys with high contents of Cr and Si was composed multi-phases with hard and thermally stable such as Al13Cr4Si4, AlCrSi, Al8Cr5 and Cr3Si intermetallic compounds. The average hardness values were 703 Hv for S5, 698 Hv for S10 and 824 Hv for S20 alloy. Enhancement of hardness value was resulted from the formation of the multi-intermetallic compound with hard and thermally stable and fine microstructure by the addition of high Cr and Si using rapid solidification and SPS process.