Details

Title

Two Optimization Ways of DDR3 Transmission Line Equal-Length Wiring Based on Signal Integrity

Journal title

International Journal of Electronics and Telecommunications

Yearbook

2021

Volume

vol. 67

Issue

No 3

Affiliation

Cheng, Kaixing : Artificial Intelligence Key Laboratory of Sichuan Province, Sichuan University of Science and Engineering, Yibin, China ; Luo, Zhongqiang : Artificial Intelligence Key Laboratory of Sichuan Province, Sichuan University of Science and Engineering, Yibin, China ; Xiong, Xingzhong : Artificial Intelligence Key Laboratory of Sichuan Province, Sichuan University of Science and Engineering, Yibin, China ; Wei, Xiaohan : Artificial Intelligence Key Laboratory of Sichuan Province, Sichuan University of Science and Engineering, Yibin, China

Authors

Keywords

high-speed PCB ; signal integrity ; equal-length wiring ; HyperLynx

Divisions of PAS

Nauki Techniczne

Coverage

385-394

Publisher

Polish Academy of Sciences Committee of Electronics and Telecommunications

Bibliography

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[3] YuanWei-Qun, Song Jian-Yuan, Chen Shi-Rong, Suntak Technology Co, and LTD. Research and optimization design of high-speed pcb based on signal integrity. Journal of Guangdong University of Technology, 36(6):74–79, 2019.
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[6] Zhang Min. Signal integrity and design optimization of high speed parallel bus interface. Wireless Internet Technology, 15(6):3–4, 2019.
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[12] Nastaran Soleimani, Mohammad GH Alijani, and Mohammad H Neshati. Crosstalk analysis at near-end and far-end of the coupled transmission lines based on eigenvector decomposition. AEU-International Journal of Electronics and Communications, 112:152944, 2019.
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[18] Nastaran Soleimani, Mohammad GH Alijani, and Mohammad H Neshati. Crosstalk analysis of multi-microstrip coupled lines using transmission line modeling. International Journal of RF and Microwave Computer-Aided Engineering, 29(6):e21677, 2019.
[19] S. M¨uller, T. Reuschel, R. Rimolo-Donadio, Y. H. Kwark, H. Br¨uns, and C. Schuster. Energy-aware signal integrity analysis for high-speed pcb links. IEEE Transactions on Electromagnetic Compatibility, 57(5):1226– 1234, 2015.
[20] Jie Tang, Yi Gong, and Zhen Guo Yang. Failure analysis on cracking of blind and buried vias of printed circuit board for high-end mobile phones. Soldering and Surface Mount Technology, 31(4), 2019.
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Date

2021.09.23

Type

Article

Identifier

DOI: 10.24425/ijet.2021.137824
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